公开(公告)号：US20240096525A1

公开(公告)日：2024-03-21

申请号：US18524795

申请日：2023-11-30

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside, at least one functional layer arranged at the top side of the carrier layer and comprising a material having a temperature-dependent electrical resistance and at least one top electrode configured for electrically contacting the functional layer from a top side of the functional layer, wherein the top electrode is arranged directly on the functional layer, wherein the top electrode forms the top side of the sensor element, and wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system.

公开(公告)号：US11450457B2

公开(公告)日：2022-09-20

申请号：US16963183

申请日：2019-01-31

Applicant: TDK ELECTRONICS AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

Abstract: In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).

公开(公告)号：US11967444B2

公开(公告)日：2024-04-23

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US20220287187A1

公开(公告)日：2022-09-08

申请号：US17637725

申请日：2020-10-12

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Stefan Endler ,  Michael Krenn ,  Stephan Bigl ,  Markus Puff ,  Sebastian Redolfi

IPC: H05K3/30 ,  H05K1/18 ,  H01G2/06 ,  H05K3/34 ,  H01C7/02

Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.

公开(公告)号：US12014852B2

公开(公告)日：2024-06-18

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US20220293305A1

公开(公告)日：2022-09-15

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  H01C1/14 ,  G01K7/22 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US12177986B2

公开(公告)日：2024-12-24

申请号：US17637725

申请日：2020-10-12

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Stefan Endler ,  Michael Krenn ,  Stephan Bigl ,  Markus Puff ,  Sebastian Redolfi

IPC: H05K3/30 ,  H01C7/02 ,  H01G2/06 ,  H05K1/18 ,  H05K3/34

Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.

公开(公告)号：US20220238260A1

公开(公告)日：2022-07-28

申请号：US17617760

申请日：2020-07-03

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Christl Lisa Mead ,  Thomas Bernert ,  Sebastian Redolfi ,  Marko Vrabelj

IPC: H01C7/04 ,  H01C7/00 ,  H05K1/18 ,  H01C1/14 ,  H01C17/075

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

公开(公告)号：US12080451B2

公开(公告)日：2024-09-03

申请号：US17887375

申请日：2022-08-12

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

CPC classification number: H01C1/1413 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/029 ,  H01R12/53 ,  H01R43/0221

Abstract: An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

公开(公告)号：US12033774B2

公开(公告)日：2024-07-09

申请号：US17617760

申请日：2020-07-03

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Christl Lisa Mead ,  Thomas Bernert ,  Sebastian Redolfi ,  Marko Vrabelj

IPC: H01C7/04 ,  H01C1/14 ,  H01C7/00 ,  H01C17/075 ,  H05K1/18

CPC classification number: H01C7/042 ,  H01C1/14 ,  H01C7/006 ,  H01C17/075 ,  H05K1/182 ,  H05K2201/10196

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.