公开(公告)号：US10823973B2

公开(公告)日：2020-11-03

申请号：US16435994

申请日：2019-06-10

Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.

Inventor： Xiao-Mei Ma ,  Shin-Wen Chen ,  Long-Fei Zhang ,  Kun Li

IPC: G03B21/20 ,  G02B27/09 ,  H05K1/02

Abstract: A light projecting module for use in electronic devices, the light projecting module including a circuit board having a laser light source, a seat mounted on the circuit board, a transparent conductive film mounted on a surface of the seat away the circuit board, at least one conductive layer formed on the seat and having first and second end portions, at least one conductive ball electrically connecting the first end portion to the transparent conductive film, and at least one insulating colloid formed at a junction of the transparent conductive film, the first end portion, and the conductive ball. The second end portion of the at least one conductive layer is electrically connected to the circuit board.

公开(公告)号：US10768392B2

公开(公告)日：2020-09-08

申请号：US16185052

申请日：2018-11-09

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Long-Fei Zhang ,  Shin-Wen Chen ,  Kun Li ,  Xiao-Mei Ma

IPC: G02B7/02 ,  H04N5/225

Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.

公开(公告)号：US10666843B2

公开(公告)日：2020-05-26

申请号：US16165824

申请日：2018-10-19

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Kun Li ,  Shin-Wen Chen ,  Long-Fei Zhang ,  Xiao-Mei Ma

IPC: H04N5/225 ,  H01L27/146 ,  H01R12/77

Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.