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公开(公告)号:US11675953B2
公开(公告)日:2023-06-13
申请号:US17814991
申请日:2022-07-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: I-Shuo Liu , Chih-Chun Hsia , Hsin-Ting Chou , Kuanhua Su , William Weilun Hong , Chih Hung Chen , Kei-Wei Chen
IPC: G06F30/392 , G06T7/00 , G06F111/20
CPC classification number: G06F30/392 , G06T7/001 , G06F2111/20 , G06T2207/20021 , G06T2207/30148
Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.
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公开(公告)号:US20210343538A1
公开(公告)日:2021-11-04
申请号:US17372705
申请日:2021-07-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Te-Chien Hou , Yu-Ting Yen , Cheng-Yu Kuo , Chih Hung Chen , William Weilun Hong , Kei-Wei Chen
IPC: H01L21/3105 , B24B37/04 , H01L29/66 , B24B37/20
Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.
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