公开(公告)号：US20190115271A1

公开(公告)日：2019-04-18

申请号：US16219979

申请日：2018-12-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Ping Chiang ,  Chao-Wen Shih ,  Shou-Zen Chang ,  Albert Wan ,  Yu-Sheng Hsieh

IPC: H01L23/31 ,  H01Q21/06 ,  H01Q9/04 ,  H01Q1/22 ,  H01L21/768 ,  H01L23/00 ,  H01L23/66 ,  H01L23/528 ,  H01L23/48

Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.