摘要:
There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.
摘要:
Provided herein is a plasma display panel. The plasma display panel comprises a front substrate, a rear substrate opposite to the front substrate and having address electrodes formed thereon, a lattice-shaped partition wall formed between the front substrate and the rear substrate, a phosphor applied to a discharge space partitioned by the partition wall, and a plurality of scanning electrodes and common electrodes formed in intersection regions of the partition wall and extending perpendicular to the front substrate. The plasma display panel has a sufficient aperture ratio, and thus has enhanced light emitting efficiency. The scanning electrodes and the common electrodes formed in the intersection regions of the partition walls have a vertical construction, thereby effectively preventing the phosphor from being damaged by the plasma. Discharge uniformly occurs at the outer periphery of the discharge cell, thereby inducing effective excitation of the phosphor.
摘要:
Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.