公开(公告)号：US20130252368A1

公开(公告)日：2013-09-26

申请号：US13893015

申请日：2013-05-13

Applicant: XINTEC INC.

Inventor： Yu-Lung HUANG ,  Yu-Ting HUANG

IPC: H01L31/0203

CPC classification number: H01L31/0203 ,  B81B7/0077 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/01005 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

Abstract: According to an embodiment, a chip package is provided, which includes: a substrate having a first surface and a second surface; a device region formed in the substrate; a passivation layer formed overlying the first surface of the substrate; at least a polymer planarization layer formed overlying the passivation layer; a package substrate disposed overlying the first surface of the substrate; and a spacer layer disposed between the package substrate and the passivation layer, wherein the spacer layer and the package substrate surround a cavity overlying the substrate, wherein the polymer planar layer does not extends to an outer edge of the spacer layer.

Abstract translation: 根据实施例，提供一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的器件区域; 形成在衬底的第一表面上的钝化层; 至少形成在所述钝化层上的聚合物平坦化层; 封装基板，设置在所述基板的第一表面上方; 以及间隔层，其设置在所述封装基板和所述钝化层之间，其中所述间隔层和所述封装基板围绕覆盖所述基板的空腔，其中所述聚合物平面层不延伸到所述间隔层的外边缘。