摘要:
Devices and processes for performing shear-assisted extrusion include a rotatable extrusion die with a scroll face configured to draw plasticized material from an outer edge of a billet generally perpendicularly toward an extrusion orifice while the extrusion die assembly simultaneously applies a rotational shear and axial extrusion force to the billet.
摘要:
The present disclosure provides a method of dual-phase hot metal extrusion comprising (i) providing a load carrier made of a first metal material, wherein the load carrier comprises one or more load chambers containing a second metal material, wherein the melting point of the second metal material is lower than the melting point of the first metal material, (ii) heating the load carrier to a temperature above the melting point of the second metal material and suitable for extrusion of the load carrier, and (iii) extruding the load carrier to form an extruded product. The present disclosure also provides apparatuses for accomplishing the dual-phase hot extrusion of metals and products resulting from such processes.
摘要:
A container for use in a metal extrusion press comprises a mantle having an elongate axial bore therein, the bore having a first transverse axis orthogonal to a second transverse axis, and a plurality of longitudinally extending heating elements accommodated by the mantle adjacent the bore. The heating elements are individually controllable for controlling a thermal profile within the container. The container also comprises a plurality of temperature sensors configured to measure the thermal profile within the container. The temperature sensors comprise a first temperature sensor and a second temperature sensor positioned on opposite sides of the first transverse axis, and a third temperature sensor and a fourth temperature sensor positioned on opposite sides of the second transverse axis.
摘要:
An extrusion die using a shock-absorbing pad and a method for manufacturing an extrusion. A shock-absorbing pad is inserted between a material to be processed and a die such that the shock-absorbing pad is deformed during extrusion to form an optimal die half angle, thereby efficiently extruding the material to be processed. The extrusion die for extruding the material to be processed includes a container for accommodating a material to be processed, a die which is mounted on the front of the container, and which has, in the center thereof, a die hole that is a path through which the material to be processed is extruded, a shock-absorbing pad inserted between the material to be processed and the die, and a ram for pressing the material to be processed.
摘要:
The present disclosure provides a method of dual-phase hot metal extrusion comprising (i) providing a load carrier made of a first metal material, wherein the load carrier comprises one or more load chambers containing a second metal material, wherein the melting point of the second metal material is lower than the melting point of the first metal material, (ii) heating the load carrier to a temperature above the melting point of the second metal material and suitable for extrusion of the load carrier, and (iii) extruding the load carrier to form an extruded product. The present disclosure also provides apparatuses for accomplishing the dual-phase hot extrusion of metals and products resulting from such processes.
摘要:
An extrusion press includes a container mover that moves a container at an end platen and molding a product by extruding a billet loaded in the container from a die by a stem driven by a main cylinder device, wherein the extrusion press includes a deflection amount detector that detects a deflection amount of the die; a deflection amount of the die during extrusion is detected; a deviation between the detected deflection amount and a reference deflection amount of the die set in advance is mathematically processed; and the extrusion press includes a controller that sends an output to the container mover to reduce a container sealing force when the deviation is minus, or increase the container sealing force when the deviation is plus so that a container sealing force corresponding to the reference deflection amount acts on an end surface of the die.
摘要:
Methods are provided for joining two panels by welding together a seam formed at a flange of each panel using a welding tractor adapted to travel along the seam to be welded. A welding tractor adapted for use in the methods is also provided, as is a welded panel product fabricated using the methods provided.
摘要:
An expandable panel includes a generally planar panel portion, penetrated by several pluralities of spaced parallel cuts. The cuts include aligned sets of apertures and aligned sets of transverse gaps. The panel is expandable by pulling the sides apart, separating the panel along the cuts. The positioning of the apertures and gaps causes the panel portions defined between the parallel cuts to bend apart, defining front and back planes, to which sheathing, surface panels, or “skins,” can be attached. The panel can be locked in its open position by inserting connectors in adjacent aligned gaps.
摘要:
The invention relates to an extruding and pipe press comprising a press frame that consists of a cylindrical spar and of a counter spar, which are joined to one another in a non-positive manner by upper and lower pretensioned drawing lamellae as well as by upper and lower pressure supports. A mobile running spar and a mobile feeder, which transfers a block to be pressed, said block being introduced by a charging device, to a pressing position in front of the counter spar with the die, are mounted inside said press frame. The running spar and the feeder can be displaced inside the press frame by means of guide units that comprise roll bodies.
摘要:
A IC wiring connecting method for interconnecting conductive lines of the same wiring plane of an IC chip for correcting the wiring, for interconnecting conductive lines of different wiring lanes of a multilayer IC chip at the same position, or for connecting a conductive line of a lower wiring plane of a multilayer IC chip to a conductive line formed at a separate position on the same multilayer IC chip. The insulating film or films covering conductive lines to be interconnected are processed by an energy beam such as a concentrated ion beam to form holes so as to expose the respective parts of the conductive lines where the conductive lines are to be interconnected, then a metal is deposited over the surfaces of the holes and an area interconnecting the holes by irradiating the surfaces of the holes and the area by an energy beam or a concentrated ion beam in an atmosphere of a gaseous organic metal compound to form a conductive metal film electrically interconnecting the conductive lines. Also provided is an apparatus for carrying out the IC wiring connecting method, which comprises, as essential components, an ion beam material processing system, an insulating film forming system such as a laser induced CVD unit, a conductive film forming system, and an insulating film etching system.