公开(公告)号：US10658238B2

公开(公告)日：2020-05-19

申请号：US15784764

申请日：2017-10-16

Applicant: STMicroelectronics Pte Ltd

Inventor： Kim-Yong Goh ,  Xueren Zhang ,  Yiyi Ma

IPC: B81B7/00 ,  H01L21/78 ,  H01L23/00 ,  H01L27/146 ,  H01L23/053

Abstract: Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.

公开(公告)号：US10557812B2

公开(公告)日：2020-02-11

申请号：US15367081

申请日：2016-12-01

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Olivier Le Neel ,  Alexandre Le Roch ,  Ayoub Lahlalia ,  Ravi Shankar

IPC: G01N27/18 ,  G01N33/00

Abstract: The present disclosure is directed to a gas sensor that includes an active sensor area that is exposed to an environment for detection of elements. The gas sensor may be an air quality sensor that can be fixed in position or carried by a user. The gas sensor includes a heater formed above chamber. The gas sensor includes an active sensor layer above the heater that forms the active sensor area. The gas sensor can include a passive conductive layer, such as a hotplate that further conducts and distributes heat from the heater to the active sensor area. The heater can include a plurality of extensions. The heater can also include a first conductive layer and a second conductive layer on the first conductive layer where the second conductive layer includes a plurality of openings to increase an amount of heat and to more evenly distribute heat from the heater to the active sensor area.

公开(公告)号：US20190319157A1

公开(公告)日：2019-10-17

申请号：US16378153

申请日：2019-04-08

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics Pte Ltd

Inventor： Romain COFFY ,  Laurent HERARD ,  David GANI

IPC: H01L31/12 ,  H01L31/0203

Abstract: A carrier wafer has a back face and a front face and a network of electrical connections between the back face and the front face. A first electronic chip is mounted with its bottom face on top of the front face of the carrier wafer. The first electronic chip has a through-opening extending between the bottom face and a face. A second electronic chip is installed in the through-opening and mounted to the front face of the carrier wafer.

公开(公告)号：US20190267302A1

公开(公告)日：2019-08-29

申请号：US16270927

申请日：2019-02-08

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yun LIU ,  David GANI

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.

公开(公告)号：US20190257780A1

公开(公告)日：2019-08-22

申请号：US16397635

申请日：2019-04-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier LE NEEL ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/22 ,  G01L19/00 ,  H01L27/02 ,  G01K7/16 ,  G01K7/20 ,  G01K7/18 ,  G01K7/01 ,  G01L9/12 ,  H01L25/00 ,  H01L25/065 ,  H01L29/78

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US10297534B2

公开(公告)日：2019-05-21

申请号：US15949541

申请日：2018-04-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US10269583B2

公开(公告)日：2019-04-23

申请号：US14981338

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/29

Abstract: The embodiments of the present disclosure relate to a semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a die attachment pad; a stud bump located on the die attachment pad and in direct contact with the die attachment pad; a first die located on the stud bump and electrically coupled to the stud bump; and a conductive attachment material located between the die attachment pad and the first die.

公开(公告)号：US10244638B2

公开(公告)日：2019-03-26

申请号：US14981185

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/28 ,  H05K3/30

Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.

公开(公告)号：US10181453B2

公开(公告)日：2019-01-15

申请号：US15406589

申请日：2017-01-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian Zhou

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.

公开(公告)号：US10126462B2

公开(公告)日：2018-11-13

申请号：US14982518

申请日：2015-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01V8/12 ,  G01V13/00

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.