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公开(公告)号：US20210247344A1
公开(公告)日：2021-08-12
申请号：US17236750
申请日：2021-04-21
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Malek Brahem , Hatem Majeri , Olivier Le Neel , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.
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公开(公告)号：US20210214211A1
公开(公告)日：2021-07-15
申请号：US17115137
申请日：2020-12-08
Applicant: STMicroelectronics Pte Ltd
Inventor： Ravi Shankar , Tien Choy Loh , Ananya Venkatesan
Abstract: A blind opening is formed in a bottom surface of a semiconductor substrate to define a thin membrane suspended from a substrate frame. The thin membrane has a topside surface and a bottomside surface. A stress structure is mounted to one of the topside surface or bottomside surface of the thin membrane. The stress structure induces a bending of the thin membrane which defines a normal state for the thin membrane. Piezoresistors are supported by the thin membrane. In response to an applied pressure, the thin membrane is bent away from the normal state and a change in resistance of the piezoresistors is indicative of the applied pressure.
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公开(公告)号：US11009477B2
公开(公告)日：2021-05-18
申请号：US16397635
申请日：2019-04-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/01 , G01K7/16 , G01K7/18 , G01K7/20 , G01L9/12 , H01L25/00 , H01L27/02 , H01L29/78 , G01N27/22 , H01L25/065 , G01L19/00 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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324.发明申请公开(公告)号：US20210020555A1
公开(公告)日：2021-01-21
申请号：US16927776
申请日：2020-07-13
Inventor： Laurent HERARD , David PARKER , David GANI
IPC: H01L23/498 , H01L21/48
Abstract: The present disclosure provides devices and methods in which a semiconductor chip has a reduced size and thickness. The device is manufactured by utilizing a sacrificial or dummy silicon wafer. A recess is formed in the dummy silicon wafer where the semiconductor chip is mounted in the recess. The space between the dummy silicon wafer and the chip is filled with underfill material. The dummy silicon wafer and the backside of the chip are etched using any suitable etching process until the dummy silicon wafer is removed, and the thickness of the chip is reduced. With this process, the overall thickness of the semiconductor chip can be thinned down to less than 50 μm in some embodiments. The ultra-thin semiconductor chip can be incorporated in manufacturing flexible/rollable display panels, foldable mobile devices, wearable displays, or any other electrical or electronic devices.
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公开(公告)号：US10658238B2
公开(公告)日：2020-05-19
申请号：US15784764
申请日：2017-10-16
Applicant: STMicroelectronics Pte Ltd
Inventor： Kim-Yong Goh , Xueren Zhang , Yiyi Ma
IPC: B81B7/00 , H01L21/78 , H01L23/00 , H01L27/146 , H01L23/053
Abstract: Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.
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Patent Agency Ranking
公开(公告)号：US10557812B2
公开(公告)日：2020-02-11
申请号：US15367081
申请日：2016-12-01
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Alexandre Le Roch , Ayoub Lahlalia , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor that includes an active sensor area that is exposed to an environment for detection of elements. The gas sensor may be an air quality sensor that can be fixed in position or carried by a user. The gas sensor includes a heater formed above chamber. The gas sensor includes an active sensor layer above the heater that forms the active sensor area. The gas sensor can include a passive conductive layer, such as a hotplate that further conducts and distributes heat from the heater to the active sensor area. The heater can include a plurality of extensions. The heater can also include a first conductive layer and a second conductive layer on the first conductive layer where the second conductive layer includes a plurality of openings to increase an amount of heat and to more evenly distribute heat from the heater to the active sensor area.
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公开(公告)号：US20190319157A1
公开(公告)日：2019-10-17
申请号：US16378153
申请日：2019-04-08
Inventor： Romain COFFY , Laurent HERARD , David GANI
IPC: H01L31/12 , H01L31/0203
Abstract: A carrier wafer has a back face and a front face and a network of electrical connections between the back face and the front face. A first electronic chip is mounted with its bottom face on top of the front face of the carrier wafer. The first electronic chip has a through-opening extending between the bottom face and a face. A second electronic chip is installed in the through-opening and mounted to the front face of the carrier wafer.
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公开(公告)号：US10297534B2
公开(公告)日：2019-05-21
申请号：US15949541
申请日：2018-04-10
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Wing Shenq Wong
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/495 , H01L23/00 , H01L25/065 , H01L23/31
Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.
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公开(公告)号：US10269583B2
公开(公告)日：2019-04-23
申请号：US14981338
申请日：2015-12-28
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En Luan
IPC: H01L23/495 , H01L25/00 , H01L21/48 , H01L23/00 , H01L23/31 , H01L25/065 , H01L23/29
Abstract: The embodiments of the present disclosure relate to a semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a die attachment pad; a stud bump located on the die attachment pad and in direct contact with the die attachment pad; a first die located on the stud bump and electrically coupled to the stud bump; and a conductive attachment material located between the die attachment pad and the first die.
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公开(公告)号：US10244638B2
公开(公告)日：2019-03-26
申请号：US14981185
申请日：2015-12-28
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En Luan
Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.
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