公开(公告)号：US20130321243A1

公开(公告)日：2013-12-05

申请号：US13895899

申请日：2013-05-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chien-Yao CHANG ,  Yaw-Huei CHIOU

IPC: G06F3/14

CPC classification number: G06F3/1446 ,  G06F3/1454 ,  G09G5/14 ,  G09G2330/021 ,  G09G2330/022 ,  G09G2340/0407 ,  G09G2354/00 ,  G09G2370/20

Abstract: A displaying method of integrating multiple electronic devices in a display device is disclosed. At least one of the electronic devices or the display device has compatible data. The displaying method includes steps: establishing a connection between the electronic devices and the display device, respectively; transferring the compatible data to the electronic devices or the display device without compatible data by the electronic device or the display device which includes the compatible data via the connection; generating a plurality of display areas at the display device according to the compatible data and displaying display information of the electronic devices at the display areas, respectively; and transmitting an input signal to the electronic device by the display device according to the display area corresponding to an occurring position of the input event, wherein the input signal corresponds to an input event and the electronic device corresponds to the display area.

Abstract translation: 公开了一种在显示装置中集成多个电子装置的显示方法。 至少一个电子设备或显示设备具有兼容的数据。 显示方法包括步骤：分别在电子设备和显示设备之间建立连接; 通过该连接将电子设备或包括该兼容数据的显示设备的兼容数据传送到电子设备或显示设备; 根据兼容数据在显示装置产生多个显示区域，并分别在显示区域显示电子设备的显示信息; 以及根据与所述输入事件的出现位置相对应的显示区域，通过所述显示装置向所述电子设备发送输入信号，其中所述输入信号对应于输入事件，并且所述电子设备对应于所述显示区域。

公开(公告)号：US20130299071A1

公开(公告)日：2013-11-14

申请号：US13887624

申请日：2013-05-06

Applicant: ASUSTEK COMPUTER INC.

Inventor： Hung-Yuan WANG ,  Yang-Po CHIU ,  Chih-Hung CHUANG

IPC: B32B38/00

CPC classification number: B32B38/0012 ,  B29C66/721 ,  B29C70/088 ,  B29C70/202 ,  B29C70/46 ,  B32B15/00 ,  B32B37/12 ,  B32B38/12 ,  B32B2305/076 ,  B32B2311/30 ,  Y10T156/1002

Abstract: A manufacturing method of composite material includes following steps: shaping a stainless steel plate to a stainless structural component; putting the stainless structural component in a female mold; putting a fiber material over a surface of the stainless structural component away from the female mold; and pressing a male mold towards the female mold to make the fiber material attached to the stainless structural component. The present invention is able to make different materials attached to each other to form a composite material in a simple and efficient manufacturing process, and the composite material is light; thin and has advantages of high rigidity and high strength.

Abstract translation: 复合材料的制造方法包括以下步骤：将不锈钢板成形为不锈钢结构部件; 将不锈钢结构件放入阴模中; 将纤维材料放置在远离阴模的不锈钢结构部件的表面上方; 并将阳模压向阴模，使纤维材料附着在不锈钢构件上。 本发明能够在简单且高效的制造工艺中使不同的材料彼此附接以形成复合材料，并且复合材料是轻的; 具有刚性高，强度高的优点。

公开(公告)号：US12279234B2

公开(公告)日：2025-04-15

申请号：US17826941

申请日：2022-05-27

Applicant: ASUSTek Computer Inc.

Inventor： Ming-Che Li

IPC: H04W72/02 ,  H04W72/08 ,  H04W72/541

Abstract: A method and apparatus are disclosed for a device to perform sidelink communication. The device triggers or requests to perform partial sensing-based resource selection in a first Transmission Time Interval (TTI) in a sidelink resource pool. The device also derives or determines a set of candidate TTIs within a resource selection window in response to the trigger or request, wherein sidelink resources in the set of candidate TTIs are candidate sidelink resources. Furthermore, when the device does not perform sensing in a second TTI, the device excludes a number of candidate sidelink resources, from the candidate sidelink resources, associated with the second TTI, wherein the second TTI is after the first TTI and before the first candidate TTI of the set of candidate TTIs. The device further derives or determines a set of sidelink resources, from the candidate sidelink resources at least excluding the number of candidate sidelink resources.

公开(公告)号：US12271237B2

公开(公告)日：2025-04-08

申请号：US18307795

申请日：2023-04-27

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chih-Han Chang ,  Tsung-Ju Chiang ,  Chi-Hung Lin ,  Yen-Ting Liu

IPC: G06F1/16

Abstract: A foldable electronic device includes a first body having an end and a first inclined surface, a second body having a second inclined surface, and a hinge module. The end includes an accommodating area. A virtual shaft line exists between sides of the first inclined surface and the second inclined surface that are closest to each other. The second body rotates relative to the first body through the virtual shaft line. The hinge module includes a first bracket adjacent to the first inclined surface, connected to the first body, and located in the accommodating area, a second bracket adjacent to the second inclined surface and connected to the second body, and a third bracket including a first end and a second end. The first bracket is connected to the first end through a first torsion assembly. The second bracket is connected to the second end through a second torsion assembly.

公开(公告)号：US20250103643A1

公开(公告)日：2025-03-27

申请号：US18534185

申请日：2023-12-08

Applicant: ASUSTEK COMPUTER INC.

Inventor： Shu-Yun CHEN ,  Chuen-An SHIH

IPC: G06F16/54 ,  G06F16/538 ,  G06F16/583

Abstract: A file viewing method applies to a file viewing system including a first client electronic device and a second client electronic device. The second client electronic device includes a target object and an application program adapted to view the target object. The file viewing method includes receiving, by the second client electronic device, an instruction generated by the first client electronic device after determining that the second client electronic device has established a connection to the first client electronic device; executing, by the second client electronic device according to the instruction, the application program to open the target object, to further generate an operable model; and transmitting, by the second client electronic device, a model image corresponding to the operable model to the first client electronic device at an adjustable frame rate, and displaying the model image on a user interface of the first client electronic device.

公开(公告)号：US20250097590A1

公开(公告)日：2025-03-20

申请号：US18755704

申请日：2024-06-27

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kuan-Yuan Chen ,  Sheng-Hsiung Chang ,  Meng-Shan Lin

IPC: H04N23/80

Abstract: An electronic device and an image processing method thereof are provided. The image processing method includes the following steps: detecting whether a buffer has second image data when performing a first compositing operation of first image data; detecting whether an image capturing operation of third image data is performed; judging a first time point for obtaining the third image data; and comparing a second time point for completing the first compositing operation to the first time point and determining whether to perform a second compositing operation of the second image data first or a third compositing operation of the third image data first.

公开(公告)号：US20250080715A1

公开(公告)日：2025-03-06

申请号：US18808064

申请日：2024-08-18

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yi-Jer Yu ,  Liang-Hsin Chien ,  Yi-Hao Chen

IPC: H04N17/00

Abstract: An electronic device and a method for testing an image stabilization function thereof are provided. The method is adapted for the electronic device including an image capturing module, and includes the following. While the electronic device is in a static state, a static image of a test pattern is captured through the image capturing module. While the electronic device is in the static state, a vibration simulation signal is provided to the image capturing module. During a period of providing the vibration simulation signal to the image capturing module, a vibration compensation image of the test pattern is captured using an Optical Image Stabilization (OIS) function through the image capturing module. According to a pattern size of the test pattern in the static image and a pattern size of the test pattern in the vibration compensation image, a test result of the OIS function is generated.

公开(公告)号：US20250076991A1

公开(公告)日：2025-03-06

申请号：US18526545

申请日：2023-12-01

Applicant: ASUSTEK COMPUTER INC.

Inventor： Sheng-Ta LIN ,  Tsung-Ju CHIANG

IPC: G06F3/02 ,  G06F1/16 ,  G06F3/0354 ,  H01H13/7065

Abstract: The disclosure provides an electronic device. The electronic device includes a body, a touchpad, and a keyboard module. The body includes a surface, where the surface includes a first portion and a second portion that are adjacent to each other. The touchpad is arranged on the first portion. The keyboard module is arranged on the second portion and includes a first key. The first key includes a base plate, a circuit layer, a resilient structure, a key cap, and a conductor layer. The circuit layer is arranged on the base plate and configured to generate a first input signal. The resilient structure is arranged on the base plate. The key cap is arranged on the resilient structure. The conductor layer is arranged below the key cap and divided into a plurality of regions, where the regions are separated from each other and are configured to generate a plurality of second input signals.

公开(公告)号：US12245373B2

公开(公告)日：2025-03-04

申请号：US17592126

申请日：2022-02-03

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han Tsou ,  Li-Chien Wan

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.

公开(公告)号：USD1060358S1

公开(公告)日：2025-02-04

申请号：US29828396

申请日：2022-02-25

Applicant: ASUSTEK COMPUTER INC.

Designer： Yi Chen Yen ,  Chung Yu Tseng ,  Lena Li