公开(公告)号：US20090137874A1

公开(公告)日：2009-05-28

申请号：US11984915

申请日：2007-11-26

Applicant: Ching-Hsiang Cheng ,  Chen Chao ,  Yin-Nee Cheung

Inventor： Ching-Hsiang Cheng ,  Chen Chao ,  Yin-Nee Cheung

IPC: A61M5/142 ,  F16K31/02 ,  B21K1/20

CPC classification number: F16K99/0001 ,  B01L3/502738 ,  B01L2400/0481 ,  B01L2400/0633 ,  F16K99/0009 ,  F16K99/0046 ,  F16K99/0048 ,  F16K2099/0074 ,  F16K2099/0088 ,  F16K2099/0094 ,  Y10T29/49416

Abstract: The present invention relates to a microvalve having a valve plug, connecting legs, anchors and actuators, allowing the valve plug to move vertically to open or close the valve. The valve plug can contain magnetic materials, and be operated by an actuator.

Abstract translation: 本发明涉及一种具有阀塞，连接腿，锚和致动器的微型阀，允许阀塞垂直移动以打开或关闭阀。 阀塞可以包含磁性材料，并由致动器操作。

公开(公告)号：US20060075818A1

公开(公告)日：2006-04-13

申请号：US11144184

申请日：2005-06-04

Applicant: Yongli Huang ,  Xuefeng Zhuang ,  Butrus Khuri-Yakub ,  Ching-Hsiang Cheng ,  Arif Ergun

Inventor： Yongli Huang ,  Xuefeng Zhuang ,  Butrus Khuri-Yakub ,  Ching-Hsiang Cheng ,  Arif Ergun

IPC: G01H11/00

CPC classification number: B06B1/0292

Abstract: The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.