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    Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device
    31.
    发明授权
    Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device 有权

    公开(公告)号：US11560465B2

    公开(公告)日：2023-01-24

    申请号：US16498798

    申请日：2018-03-30

    Applicant: ENEOS CORPORATION

    Inventor： Yoshinori Nishitani ,  Masaki Minami

    IPC: C08K5/3472 ,  H01L23/29 ,  C08L79/04

    Abstract: Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

    POLYIMIDE, VARNISH, AND FILM
    32.
    发明申请
    POLYIMIDE, VARNISH, AND FILM 有权

    公开(公告)号：US20220372223A1

    公开(公告)日：2022-11-24

    申请号：US17640484

    申请日：2020-09-09

    Applicant: ENEOS Corporation

    Inventor： Masatoshi HASEGAWA ,  Junichi ISHII ,  Daisuke WATANABE

    IPC: C08G73/10 ,  C08J5/18 ,  C09D179/08

    Abstract: Provided is a polyimide having a repeating unit represented by the following Formula (1): wherein R1 represents a tetravalent group; R2 represents a divalent group; provided that at least one of R1's is represented by the following Formula (2); and among R2's, at least one group is represented by the following Formula (3), and at least one other group is represented by the following Formula (4):

    CROSS-LINKED METHACRYLATE RESIN PARTICLES AND A PORE-FORMING AGENT
    36.
    发明申请
    CROSS-LINKED METHACRYLATE RESIN PARTICLES AND A PORE-FORMING AGENT 有权

    公开(公告)号：US20220325020A1

    公开(公告)日：2022-10-13

    申请号：US17634528

    申请日：2020-07-08

    Applicant: ENEOS Corporation

    Inventor： Hiroaki MURAKAMI

    IPC: C08F220/14

    Abstract: Disclosed are resin particles having excellent thermal decomposability and suitable hardness. The resin particles are cross-linked methacrylate resin particles obtained by polymerizing monofunctional methacrylate and polyfunctional methacrylate, wherein the blending amount of the monofunctional methacrylate is 60% by mass to 95% by mass and the blending amount of the polyfunctional methacrylate is 5% by mass to 40% by mass with respect to the total amount of methacrylate compound, being a raw material for the polymerization reaction; the number of carbon atoms in the ester substituent of the monofunctional methacrylate is 3 or less; and 5% mass reduction temperature of the cross-linked methacrylate resin particles as measured by thermogravimetric differential thermal analysis is 180° C. or more and 240° C. or less.

    Adhesive tape
    40.
    发明授权
    Adhesive tape 有权

    公开(公告)号：US11325342B2

    公开(公告)日：2022-05-10

    申请号：US16473453

    申请日：2017-12-19

    Applicant: ENEOS Corporation

    Inventor： Tomoyuki Okamura ,  Liang Huang ,  Masahiro Wakayama

    IPC: B32B5/12 ,  C09J7/24 ,  B32B7/02 ,  B32B5/08 ,  C09J7/22 ,  B32B5/02 ,  B32B27/12 ,  B32B27/32 ,  C09J7/21 ,  B32B7/022 ,  B32B3/26 ,  C09J7/29

    Abstract: A substrate 2 of an adhesive tape 1 includes a mesh structure made of thermoplastic resin. The mesh structure has a structure in which multiple first fibers drawn in a first direction corresponding to a length direction of the adhesive tape and multiple second fibers drawn in a second direction corresponding to a width direction of the adhesive tape are layered or woven. (a) A first fiber has a thickness of 0.04 mm or less, and a width of 0.6 mm or less, (b) a second fiber has a thickness greater than that of the first fiber, and a width greater than or equal to that of the first fiber, (c) the mesh structure has a tensile strength in the first direction of from 130 to 250 N/50 mm, (d) the mesh structure has a bending resistance in the first direction obtained by a cantilever test of from 40 to 80 mm, and (e) the mesh structure has a bending resistance in the second direction obtained by the cantilever test of from 65 to 95 mm.

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