公开(公告)号：US12258472B2

公开(公告)日：2025-03-25

申请号：US17606681

申请日：2020-04-23

Applicant: ENEOS Corporation

Inventor： Yoshinori Nishitani ,  Tatsuki Sato ,  Masaki Minami

IPC: C08L79/02 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08G59/68 ,  C08G73/02 ,  C08K3/013 ,  C08L63/00 ,  C08L79/04 ,  H01L23/29 ,  H01L23/31

Abstract: Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is a resin composition, cured product thereof, and methods of producing the composition and the product, wherein the composition includes: (A) multifunctional benzoxazine compound having at least two benzoxazine rings, (B) epoxy compound containing at least one epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) curing agent; wherein composition consisting of (A), (B), and (C) has weight-average molecular weight of 350 or more and 650 or less in terms of polystyrene. Additionally provided is a semiconductor device where semiconductor element is disposed in the cured product obtained by curing the composition containing components (A) to (C), and optionally components (D) and/or (E).

公开(公告)号：US11578166B2

公开(公告)日：2023-02-14

申请号：US16759688

申请日：2018-10-26

Applicant: ENEOS Corporation

Inventor： Yoshinori Nishitani ,  Masaki Minami ,  Tatsuki Sato

IPC: C08G59/26 ,  C07D265/16 ,  C08G59/24 ,  C08K3/36 ,  H01L23/29

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

公开(公告)号：US11560465B2

公开(公告)日：2023-01-24

申请号：US16498798

申请日：2018-03-30

Applicant: ENEOS CORPORATION

Inventor： Yoshinori Nishitani ,  Masaki Minami

IPC: C08K5/3472 ,  H01L23/29 ,  C08L79/04

Abstract: Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

公开(公告)号：US11897998B2

公开(公告)日：2024-02-13

申请号：US16759677

申请日：2018-10-26

Applicant: ENEOS Corporation

Inventor： Yoshinori Nishitani ,  Masaki Minami ,  Tatsuki Sato

IPC: C08G59/62

CPC classification number: C08G59/621

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

公开(公告)号：US11584824B2

公开(公告)日：2023-02-21

申请号：US16759704

申请日：2018-10-26

Applicant: ENEOS Corporation

Inventor： Yoshinori Nishitani ,  Masaki Minami ,  Tatsuki Sato

IPC: C08G59/62 ,  C08G59/24 ,  C08K3/36 ,  H01L23/29

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

公开(公告)号：US11555092B2

公开(公告)日：2023-01-17

申请号：US17264724

申请日：2019-08-01

Applicant: ENEOS CORPORATION

Inventor： Yoshinori Nishitani ,  Tatsuki Sato ,  Masaki Minami

IPC: C08G59/50 ,  C08G59/24 ,  C08K3/36 ,  C08K7/18 ,  H01L23/29

Abstract: The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.