Flip-chip automatically aligned optical device
    31.
    发明授权
    Flip-chip automatically aligned optical device 有权
    倒装芯片自动对准光学设备

    公开(公告)号:US07079559B2

    公开(公告)日:2006-07-18

    申请号:US10374798

    申请日:2003-02-25

    Abstract: A semiconductor laser device with a first side and a second side, comprising (a) an active region, (b) a P layer, wherein the P layer contains a first contact area, (c) an N layer, wherein said N layer contains a second contact area, wherein the contact area of the first contact area of the P layer and the second contact layer of the N layer reside on the first side of the laser device.

    Abstract translation: 一种具有第一侧面和第二面的半导体激光器件,包括(a)有源区,(b)P层,其中所述P层包含第一接触区域,(c)N层,其中所述N层包含 第二接触区域,其中P层的第一接触区域和N层的第二接触层的接触面积位于激光器件的第一侧上。

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