公开(公告)号：US20190237931A1

公开(公告)日：2019-08-01

申请号：US16239083

申请日：2019-01-03

申请人： OEpic SEMICONDUCTORS, INC.

发明人： YI-CHING PAO

IPC分类号： H01S5/022 ,  H01S5/183 ,  H01S5/187 ,  H01S5/42 ,  H01S5/323 ,  H01S5/042 ,  H01S5/024

CPC分类号： H01S5/0224 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/0425 ,  H01S5/18344 ,  H01S5/187 ,  H01S5/323 ,  H01S5/423

摘要： A flip chip backside Vertical Cavity Surface Emitting Laser (VCSEL) package has a VCSEL pillar array. A first metal contact is formed over a top section of each pillar of the VCSEL pillar array. A second metal contact is formed on a back surface of the VCEL pillar array. An opening is formed in the second metal contact and aligned with the pillars of the VCSEL pillar array. Solder tip is applied on each pillar of the VCSEL pillar array to flip chip mount the VCSEL pillar array.

公开(公告)号：US20190196205A1

公开(公告)日：2019-06-27

申请号：US16231326

申请日：2018-12-21

申请人： NORTH INC.

发明人： Jörg Pierer ,  Rony Jose James ,  Stefan Mohrdiek ,  Martin Joseph Kiik ,  Syed Moez Haque ,  Douglas Raymond Dykaar

IPC分类号： G02B27/01 ,  H01S5/40 ,  H01S5/022 ,  G02B6/12 ,  G02B6/124

CPC分类号： G02B27/0176 ,  G02B6/12004 ,  G02B6/124 ,  G02B27/0172 ,  G02B2006/12107 ,  G02B2006/12164 ,  G02B2027/0116 ,  G02B2027/015 ,  G02B2027/0178 ,  H01S5/02272 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/4093

摘要： Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. A grating waveguide combiner comprising a plurality of waveguides having grating couplers thereon may be used to combine beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. Such optical engines may have advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

公开(公告)号：US20190196200A1

公开(公告)日：2019-06-27

申请号：US16231019

申请日：2018-12-21

申请人： NORTH INC.

发明人： Jörg Pierer ,  Rony Jose James ,  Stefan Mohrdiek ,  Martin Joseph Kiik ,  Syed Moez Haque ,  Douglas R. Dykaar

IPC分类号： G02B27/01 ,  H01S5/40 ,  H01S5/022 ,  G02B6/12 ,  G02B27/42 ,  H01S5/42 ,  G02B6/124

CPC分类号： G02B27/0172 ,  G02B6/12004 ,  G02B6/124 ,  G02B27/4205 ,  G02B2006/12069 ,  G02B2006/12107 ,  G02B2006/12147 ,  G02B2006/12164 ,  G02B2027/011 ,  G02B2027/0116 ,  G02B2027/0178 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/4012 ,  H01S5/4031 ,  H01S5/4093 ,  H01S5/423

摘要： Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. Photonic integrated circuits having grating or edge couplers thereon may be used to wavelength multiplex beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. A waveguide medium having one or more directly written waveguides may couple light from laser diodes to a photonic integrated circuit, and may optionally hermetically or partially hermetically seal the laser diodes, eliminating the need for a separate seal. Such optical engines may have advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

公开(公告)号：US20190036300A1

公开(公告)日：2019-01-31

申请号：US16071987

申请日：2017-02-27

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Naoto UEDA ,  Kouji OOMORI ,  Takayuki YOSHIDA

IPC分类号： H01S5/024 ,  H01S5/026 ,  H01S5/022

CPC分类号： H01S5/02423 ,  H01S5/02236 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02469 ,  H01S5/02492 ,  H01S5/026 ,  H01S5/0425 ,  H01S5/4025

摘要： A semiconductor laser device (1) includes a heat sink (20), a submount (30), a first electrode (60), an insulating layer (70), a semiconductor laser element (40), a connecting portion (50), and a second electrode (61). The submount (30) is conductive and on a first region (R1) of the upper surface of the heat sink (20). The first electrode (60) is conductive and on a second region (R2), different from the first region (R1), of the upper surface of the heat sink (20). The first electrode (60) is electrically connected either to at least part of a side surface of the submount (30) or to the upper surface of the submount (30).

公开(公告)号：US20180351324A1

公开(公告)日：2018-12-06

申请号：US15761585

申请日：2016-09-15

申请人： OSRAM Opto Semiconductors GmbH

发明人： Christoph Walter ,  Roland Enzmann ,  Markus Horn ,  Jan Seidenfaden

IPC分类号： H01S5/022 ,  H01S5/024

CPC分类号： H01S5/02272 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/02268 ,  H01S5/02461

摘要： A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.

公开(公告)号：US20180248336A1

公开(公告)日：2018-08-30

申请号：US15863662

申请日：2018-01-05

申请人： LUXNET CORPORATION

发明人： Hsing-Yen LIN ,  Pi-Cheng LAW ,  Po-Chao HUANG ,  Bo-Wei LIU ,  Ya-Hsin DENG ,  Hua-Hsin SU

IPC分类号： H01S5/024 ,  H01S5/022

CPC分类号： H01S5/02469 ,  H01S5/02236 ,  H01S5/02272 ,  H01S5/02476

摘要： An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.

公开(公告)号：US10054870B2

公开(公告)日：2018-08-21

申请号：US15364445

申请日：2016-11-30

申请人： Shinichi Harada ,  Naoto Jikutani ,  Kazuma Izumiya ,  Yusuke Okura

发明人： Shinichi Harada ,  Naoto Jikutani ,  Kazuma Izumiya ,  Yusuke Okura

IPC分类号： H01S5/183 ,  G03G15/04 ,  H01S5/343 ,  H01S5/42 ,  G02B19/00 ,  H04N1/028 ,  H04N1/06 ,  F02P23/04

CPC分类号： G03G15/04 ,  F02P23/04 ,  G02B19/0057 ,  H01S3/0627 ,  H01S3/094053 ,  H01S3/09415 ,  H01S3/113 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/18311 ,  H01S5/18313 ,  H01S5/18322 ,  H01S5/18358 ,  H01S5/18377 ,  H01S5/3202 ,  H01S5/34313 ,  H01S5/423 ,  H04N1/0283 ,  H04N1/0284 ,  H04N1/06

摘要： A surface-emitting laser includes an active layer on which a spacer layer is disposed, and a reflection mirror disposed on the spacer layer, including a current constriction layer that is a selectively-oxidized layer having been selectively oxidized. The current constriction layer is disposed at a position of a node of a standing-wave of an electric field of light oscillated at the active layer and is disposed away from an interface between the spacer layer and the reflection mirror by an optical distance of one-fourth of an oscillation wavelength at the active layer. The selectively-oxidized layer is made of AlGaAs. The reflection mirror includes at least one AlGaInP layer contacting the selectively-oxidized layer.

公开(公告)号：US10008440B2

公开(公告)日：2018-06-26

申请号：US15327297

申请日：2015-07-22

申请人： OSRAM Opto Semiconductors GmbH

发明人： Stefan Brandl ,  Tilman Eckert

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L33/62 ,  H01S5/022 ,  H01L21/48

CPC分类号： H01L23/49838 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/32221 ,  H01L2224/83801 ,  H01L2924/0002 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2933/0066 ,  H01S5/02268 ,  H01S5/02272

摘要： A carrier for an electrical component, including a substrate having a surface, with an electrically conductive contact zone arranged on the surface of the substrate, a solder pad disposed on the contact zone, and a solder stop structure disposed laterally next to the solder pad. The solder stop structure has a surface that is less wettable with liquid solder than a surface of the contact zone. The solder stop structure subdivides the contact zone into a first zone region and a second zone region, with the first zone region having the solder pad. The solder stop structure extends over a portion of a total length of the contact zone such that the contact zone has a free connecting region that is free of the solder stop structure. The first and second zone regions are connected to one another by means of the free connecting region.

公开(公告)号：US20180166611A1

公开(公告)日：2018-06-14

申请号：US15577837

申请日：2016-05-27

申请人： OSRAM Opto Semiconductors GmbH

发明人： Tilman Ruegheimer ,  Juergen Dachs

IPC分类号： H01L33/48 ,  H01S5/022 ,  H01S5/02

CPC分类号： H01L33/486 ,  H01L21/4817 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01S5/0206 ,  H01S5/0216 ,  H01S5/02216 ,  H01S5/02272 ,  H01L2924/00014

摘要： A method of producing a housing cover includes providing a cover blank having a mounting surface formed on an underside; connecting the underside of the cover blank to a silicon slice; creating at least one opening in the silicon slice to expose at least part of the mounting surface; arranging a base metallization on the exposed part of the mounting surface; and removing the silicon slice.

公开(公告)号：US09991673B2

公开(公告)日：2018-06-05

申请号：US14741081

申请日：2015-06-16

申请人： Vixar Inc.

发明人： William Hogan ,  Mary Brenner

IPC分类号： H01S3/04 ,  H01S5/022 ,  H01S5/00 ,  H01S5/183 ,  H01S5/42 ,  H01L33/48

CPC分类号： H01S5/0228 ,  H01L33/483 ,  H01L2224/48091 ,  H01S5/0042 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02296 ,  H01S5/183 ,  H01S5/423 ,  Y10T156/10 ,  Y10T156/1052 ,  H01L2924/00014

摘要： An optical package having a patterned submount, an optoelectronic device mounted to the patterned submount, a spacer affixed on one side to the patterned submount, the spacer having a bore hole therethrough wherein the optoelectronic device is positioned, and an optical element affixed to the spacer on a side opposite the patterned submount and covering the spacer bore hole. The patterned submount may be a circuit board. The optoelectronic device may be a VCSEL. The spacer may be affixed to the circuit board, for example, using an epoxy preform or an adhesive laminate. The spacer may, for example, be manufactured from a sheet of stainless steel or from a circuit board. The optical element may be, for example, a diffuser, a concave lens, a convex lens, a holographic element, polarizers, or diffraction gratings. The optical element may be affixed to the spacer using an epoxy preform or an adhesive laminate.