公开(公告)号：US20100243309A1

公开(公告)日：2010-09-30

申请号：US12659556

申请日：2010-03-12

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

IPC分类号： H05K1/11 ,  H05K3/36

CPC分类号： H05K3/363 ,  H05K3/3457 ,  H05K3/3494 ,  H05K2201/09709 ,  H05K2201/10666 ,  H05K2203/0195 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49213

摘要： Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.

摘要翻译： 公开了一种使用焊料凸块布置电路板的电路板的连接结构。 电路板连接结构包括制备在两个电路板中的一个上的焊料凸块和形成在另一个电路板上的穿孔部分以接收焊料凸块。 将两个电路板朝向彼此并将焊料凸块插入穿孔部分中，期望布置电路板。