公开(公告)号：US20150016082A1

公开(公告)日：2015-01-15

申请号：US14300795

申请日：2014-06-10

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jae Soo LEE

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H05K1/115 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1533 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0038 ,  H05K3/0097 ,  H05K3/025 ,  H05K3/428 ,  H05K3/4682 ,  H05K2201/042 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/10666 ,  H05K2203/1536 ,  H01L2924/013 ,  H01L2924/00014

摘要： A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a second circuit layer formed at a second side of the insulating layer and electrically connected with the portion of the first circuit layer in the via.

摘要翻译： 印刷电路板包括绝缘层; 在所述绝缘层中的通孔，形成在所述绝缘层的第一侧并具有埋在所述通孔中的部分的第一电路层; 形成在所述绝缘层的第二侧并与所述通孔中的所述第一电路层的所述部分电连接的第二电路层。

公开(公告)号：US20100214741A1

公开(公告)日：2010-08-26

申请号：US12632398

申请日：2009-12-07

申请人： Rie Takada ,  Kenichiro Tsubone

发明人： Rie Takada ,  Kenichiro Tsubone

IPC分类号： H05K7/20 ,  H05K1/14 ,  H05K1/00 ,  H05K3/30

CPC分类号： H05K1/147 ,  H01L23/3672 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  Y10T29/4913 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component.

摘要翻译： 电子部件安装结构包括：第一基板，其上安装有第一部件;第二基板，连接到第一基板。 第二基板朝向第一部件弯曲。

公开(公告)号：US07732900B2

公开(公告)日：2010-06-08

申请号：US11236815

申请日：2005-09-28

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01L23/495

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部 连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19， 绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

公开(公告)号：US07615707B2

公开(公告)日：2009-11-10

申请号：US11163477

申请日：2005-10-20

申请人： Yung-Jen Lin

发明人： Yung-Jen Lin

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/0094 ,  H05K3/42 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/10666 ,  Y10T29/4913

摘要： A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.

摘要翻译： 公开了一种用于形成印刷电路板的印刷电路板和形成方法。 印刷电路板包括基板和导电层。 基板包括通孔，其中基板的通孔的一侧对应于第一直径，并且基板的通孔的另一侧对应于第二直径。 第二直径大于第一直径。 导电层被放置在通孔的内表面上，用于电连接衬底的两侧。

公开(公告)号：US20090257209A1

公开(公告)日：2009-10-15

申请号：US12385575

申请日：2009-04-13

申请人： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

发明人： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

IPC分类号： H01R9/00 ,  H01R12/04

CPC分类号： H05K1/112 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

摘要： A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

摘要翻译： 一种半导体封装和相关方法，所述半导体封装包括包括插座的衬底以及包括焊球和从所述焊球延伸到所述插座中的支撑部分的连接端子。

公开(公告)号：US20080179721A1

公开(公告)日：2008-07-31

申请号：US11669880

申请日：2007-01-31

申请人： Cheng-Lien Chiang

发明人： Cheng-Lien Chiang

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H05K1/144 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/10666 ,  H05K2203/0455 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A transfer carrier comprising a transfer substrate, two aperture arrays, a contact pattern and a semiconductor device. The transfer substrate located on the opposed sides of the transfer substrate to define a cavity on the transfer substrate, the aperture arrays has a top surface and a bottom surface. The two aperture arrays have apertures extending from the top surface through to the bottom surface. The apertures have conductive layers formed on the inner surfaces of the apertures. The contact pattern is located with contacts lo electrically connected to the corresponding conductive layer of the apertures. The semiconductor device has pads arranged in identical pattern as the contact pattern, the semiconductor device being electrically connected to the contacts. The transfer carrier is also manufactured as an integrated circuit package. The transfer carriers and integrated circuit packages are stacked via solder connections.

摘要翻译： 一种转印载体，包括转印衬底，两个孔阵列，接触图案和半导体器件。 转印基板位于转印基板的相对侧上以限定转印基板上的空腔，孔阵列具有顶表面和底表面。 两个孔阵列具有从顶表面延伸到底表面的孔。 这些孔具有形成在孔的内表面上的导电层。 接触图案定位为具有电连接到孔的相应导电层的触点。 半导体器件具有以与接触图案相同的图案排列的衬垫，半导体器件电连接到触点。 转印载体也作为集成电路封装制造。 传输载体和集成电路封装通过焊料连接堆叠。

公开(公告)号：US07311240B2

公开(公告)日：2007-12-25

申请号：US10836129

申请日：2004-04-30

申请人： Kinya Nippa ,  Wei Hong Soh

发明人： Kinya Nippa ,  Wei Hong Soh

IPC分类号： B23K31/02

CPC分类号： H05K3/363 ,  B23K1/0008 ,  B23K2101/36 ,  B23K2101/42 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2203/0545

摘要： Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.

摘要翻译： 公开了用于制造两个制品之间的焊接接头的示例性方法。 该方法包括将待焊接在一起的第一制品和第二制品定位的步骤。 第一篇文章和第二篇文章中至少有一篇至少附有一个按钮。 按钮具有与其所附接的物品的表面上方的所需高度。 第二制品具有位于要形成焊点的位置的焊料量。 应用热源直到焊料液化为止。 除去热源，直到焊料以大约等于按钮高度的均匀厚度固化。

公开(公告)号：US07304247B2

公开(公告)日：2007-12-04

申请号：US10478295

申请日：2002-05-18

申请人： Dietmar Birgel ,  Sergej Lopatin

发明人： Dietmar Birgel ,  Sergej Lopatin

IPC分类号： H05K1/16

CPC分类号： H05K3/363 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/114 ,  H05K3/28 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/0979 ,  H05K2201/10666 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05655

摘要： A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer arranged on a first surface of the circuit board, a second insulating layer arranged on a second surface of the circuit board, a first contact location at which the conductor path is accessible, a second contact location, at which the conductor path is accessible through a bore passing completely through the circuit board, and an electronic component arranged on the first surface. The component has a first contact surface, which is connected with the first contact location by solder or electrically conductive adhesive, and a second contact surface which is connected with the second contact location by solder or adhesive.

摘要翻译： 在电路板和布置在其上的部件之间具有高机械承载能力的电气和机械连接的电路板。 电路板包括至少一个内部定位的导体路径，布置在电路板的第一表面上的第一绝缘层，布置在电路板的第二表面上的第二绝缘层，第一接触位置，导体路径 可接近的第二接触位置，导体路径可以通过完全穿过电路板的孔访问，以及布置在第一表面上的电子部件。 该部件具有通过焊料或导电粘合剂与第一接触位置连接的第一接触表面，以及通过焊料或粘合剂与第二接触位置连接的第二接触表面。

公开(公告)号：US20070158843A1

公开(公告)日：2007-07-12

申请号：US11621042

申请日：2007-01-08

申请人： Shin Kim ,  Se-Yong OH

发明人： Shin Kim ,  Se-Yong OH

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

摘要翻译： 提供了具有改进的焊点可靠性的半导体封装及其制造方法。 半导体封装包括印刷电路板（PCB），其具有在其表面上形成的多个互连层，并且具有连接到互连层的多个通孔。 粘合剂部件附着到PCB的上表面，并且半导体芯片电连接到互连层并且安装在粘合部件的上表面上。 焊接连接部分填充每个通孔，以便形成机械强连接，其在热瞬变和物理冲击期间耐断裂。

公开(公告)号：US07205909B2

公开(公告)日：2007-04-17

申请号：US10606797

申请日：2003-06-27

申请人： Sook Jin Lee

发明人： Sook Jin Lee

IPC分类号： H03K17/94 ,  H03M11/00

CPC分类号： G06F3/0414 ,  G06F3/0488 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10666

摘要： A touch panel device includes a wiring terminal, a flexible printed circuit film connected to the wiring terminal, an adhesion part corresponding to a location where the flexible printed circuit film is connected to the wiring terminal, and an adhesion-reinforcing part adjacent to the adhesion part for strengthening an adhesive bonding strength of the adhesion part.

摘要翻译： 触摸面板装置包括接线端子，连接到接线端子的柔性印刷电路膜，对应于柔性印刷电路膜连接到接线端子的位置的粘合部分，以及与粘合剂相邻的粘附增强部件 用于增强粘合部分的粘合强度的部分。