DISPLAY SUBSTRATES AND MANUFACTURING METHODS THEREOF, DISPLAY PANELS AND DISPLAY APPARATUSES

    公开(公告)号:US20240315115A1

    公开(公告)日:2024-09-19

    申请号:US18027221

    申请日:2022-01-14

    CPC classification number: H10K59/8731 H10K59/1201 H10K59/38 H10K2102/351

    Abstract: A display substrate and its manufacturing method, a display panel and a display apparatus are provided. The display substrate includes a base (10), a light-emitting device layer (20) on the base (10), and an encapsulation structure (30) on a side of the light-emitting device layer (20) away from the base (10). A film layer farthest from the base (10) in the light-emitting device layer (20) is a light extraction layer (21). The encapsulation structure (30) includes a first inorganic encapsulation layer (31), an organic encapsulation layer (32) on a side of the first inorganic encapsulation layer (31) away from the base (10), and a second inorganic encapsulation layer (33) on a side of the organic encapsulation layer (32) away from the base (10). The first inorganic encapsulation layer (31) includes sub-film layers in which the one closest to the light extraction layer (21) is a low-stress inorganic layer (301) with a stress less than that of the second inorganic encapsulation layer (33). The display panel includes the display substrate. The display apparatus includes the display panel.

    DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20230363202A1

    公开(公告)日:2023-11-09

    申请号:US17613998

    申请日:2020-12-18

    Abstract: The present disclosure provides a display substrate, which includes a base substrate, and a display unit, a connection unit and a hollowed-out unit, which are adjacent to each other, on the base substrate; the display unit includes a first insulating part and a conductive part; the connection unit includes a second insulating part and a conductive connecting part, the second insulating part is arranged on a side of the conductive connecting part away from the base substrate; the conductive connecting part is in contact with the base substrate, extends from an area of the base substrate where the connection unit is located to an area of the base substrate where the display unit is located, and is electrically coupled to the conductive part through a via hole formed in the first insulating part; the second insulating part has a tensile property superior to the first insulating part.

    FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND FLEXIBLE DISPLAY APPARATUS

    公开(公告)号:US20230088187A1

    公开(公告)日:2023-03-23

    申请号:US16966710

    申请日:2019-08-06

    Abstract: A flexible display panel includes: a stretchable base film; an adhesive layer disposed on a surface of the stretchable base film; a flexible substrate including a plurality of display units and a plurality of connection units, every two adjacent display units being connected by at least one connection unit; and a plurality of first release agent films disposed between the plurality of connection units and the adhesive layer, the plurality of first release agent films and the plurality of connection units being in one-to-one correspondence. An orthographic projection of each connection unit on the stretchable base film is within an orthographic projection of a corresponding first release agent film on the stretchable base film. The plurality of display units are bonded to the adhesive layer.

    STRETCHABLE DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE

    公开(公告)号:US20220407023A1

    公开(公告)日:2022-12-22

    申请号:US17764440

    申请日:2021-06-08

    Abstract: A stretchable display panel and a method for manufacturing same, and a display apparatus, which belong to the technical field of display. The method comprises: forming an organic protection structure (100) and an inorganic protection structure (200), which are stacked, on a rigid substrate (000); forming a flexible substrate (300) on the inorganic protection structure (200); forming, on the flexible substrate (300), a plurality of pixel islands and inter-island connection pieces for connecting adjacent pixel islands; forming package layers on the pixel islands and the inter-island connection pieces; and lifting off the rigid substrate (000). The package layers are not in contact with the rigid substrate (000), but the organic protection structure (100) is always in contact with the rigid substrate (000). It is extremely easy for the organic protection structure (100) to be lifted off from the rigid substrate (000), and the probability of a crack occurring during the lifting-off process is relatively low, thereby effectively reducing the probability of package failure of the package layers, and further prolonging the service life of light-emitting devices in the pixel islands.

    METHOD FOR PACKAGING DISPLAY SUBSTRATE AND PACKAGING STRUCTURE

    公开(公告)号:US20210210721A1

    公开(公告)日:2021-07-08

    申请号:US16768060

    申请日:2019-12-16

    Abstract: The present disclosure relates to a method for packaging a display substrate and a packaging structure. The packaging method includes: preparing a light conversion structure in a non-display region of the base substrate capable of converting the received first light into second light; preparing one or more organic packaging layers on a surface of the base substrate on which the light conversion structure is formed; irradiating the light conversion structure with the first light so that the rheological organic material layer in a region in which the light conversion structure is located is cured with the converted second light; and then curing all of the rheological organic material layer, in which the light conversion structure is arranged on a surface of the corresponding organic packaging layer close to the base substrate.

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