公开(公告)号：US20230165103A1

公开(公告)日：2023-05-25

申请号：US17919393

申请日：2021-06-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guoqiang WANG ,  Jinxiang XUE ,  Zhongyuan SUN

IPC: H10K59/38 ,  H10K59/12 ,  H10K59/80 ,  H10K71/00

CPC classification number: H10K59/38 ,  H10K59/1201 ,  H10K59/8792 ,  H10K71/00 ,  H10K2102/311

Abstract: A method for fabricating a stretchable display panel includes: providing a substrate, wherein a displaying unit, a connecting unit and a hollowed-out region are provided on the substrate; forming film-layer components on the substrate, wherein orthographic projections of the film-layer components on the substrate are within the displaying unit, the connecting unit and the hollowed-out region; forming a first planarization layer on a surface of the film-layer components that is away from the substrate; forming a color-film layer on one side of the first planarization layer that is away from the substrate, wherein an orthographic projection of the color-film layer on the substrate is within the displaying unit; forming a color-film protecting layer on one side of the color-film layer that is away from the substrate ; and performing an ashing process to the hollowed-out region, to remove the first planarization layer and the film-layer components within the hollowed-out region.

公开(公告)号：US20230101638A1

公开(公告)日：2023-03-30

申请号：US16975771

申请日：2019-10-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin DI ,  Ke WANG ,  Guoqiang WANG ,  Zhiwei LIANG ,  Renquan GU ,  Yingwei LIU ,  Qi YAO ,  Zhanfeng CAO

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/00

Abstract: The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

公开(公告)号：US20220093896A1

公开(公告)日：2022-03-24

申请号：US17478428

申请日：2021-09-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jinxiang XUE ,  Xiaolei ZHANG ,  Guoqiang WANG ,  Zhao CUI ,  Huili WU ,  Zhongyuan SUN ,  Kai SUI ,  Guangcai YUAN ,  Wenqi LIU ,  Yichi ZHANG

IPC: H01L51/52 ,  H01L51/56

Abstract: A display panel includes a base; a plurality of display units disposed on a surface of the base, every two adjacent display units being provided with a gap therebetween; and a connection unit disposed in the gap and connected to the every two adjacent display units. The connection unit includes a first organic layer, a conductive layer and a second organic layer that are sequentially stacked. The first organic layer and the second organic layer are each configured to block stress causing the connection unit to deform.

公开(公告)号：US20210091057A1

公开(公告)日：2021-03-25

申请号：US17010575

申请日：2020-09-02

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei LIANG ,  Wenqian LUO ,  Guoqiang WANG ,  Yingwei LIU

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/00

Abstract: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.

公开(公告)号：US20230043951A1

公开(公告)日：2023-02-09

申请号：US17790308

申请日：2021-08-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ke WANG ,  Zhanfeng CAO ,  Xinhong LU ,  Qi QI ,  Yan QU ,  Zhiwei LIANG ,  Yingwei LIU ,  Dapeng XUE ,  Guoqiang WANG ,  Jianguo WANG ,  Song LIU ,  Yongfei LI ,  Ting ZENG ,  Huan LIU ,  Wanru DONG ,  Heren GUI ,  Jian YANG ,  Haifeng HU ,  Yu JIANG ,  Peng XU ,  Weiwei CHU ,  Qi GAO

IPC: H01L33/62 ,  H01L25/075 ,  H01L21/48 ,  H01L23/498

Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

公开(公告)号：US20210226079A1

公开(公告)日：2021-07-22

申请号：US16763178

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guoqiang WANG ,  Jiushi WANG ,  Qingzhao LIU

IPC: H01L31/105 ,  H01L31/115 ,  H01L31/18

Abstract: A PIN device includes: a first doped layer, a second doped layer, and an intrinsic layer between the first doped layer and the second doped layer, where the second doped layer includes a body portion and an electric field isolating portion at least partially enclosing the body portion; and the electric field isolating portion is doped differently from the body portion.

公开(公告)号：US20200166683A1

公开(公告)日：2020-05-28

申请号：US16408973

申请日：2019-05-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qingzhao LIU ,  Jiushi WANG ,  Shuilang DONG ,  Guoqiang WANG

IPC: G02B5/30 ,  G02B5/02

Abstract: An embodiment of this disclosure discloses a metal wire grid comprising: a patterned metal layer and a patterned antireflective layer located on the patterned metal layer, wherein a surface of the antireflective layer distal to the patterned metal layer has a plurality of continuous pits. Embodiments of this disclosure further disclose a method of manufacturing a metal wire grid and a display panel.

公开(公告)号：US20230060220A1

公开(公告)日：2023-03-02

申请号：US17788395

申请日：2021-05-27

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jiahui HAN ,  Shunhang ZHANG ,  Pengxia LIANG ,  Hua HUANG ,  Guoqiang WANG ,  Zheng FANG ,  Ge SHI ,  Yujie LIU ,  Song YANG ,  Shiyu ZHANG ,  Yanliu SUN ,  Meina YU ,  Yuyao WANG

IPC: G02F1/1362 ,  G02F1/1335

Abstract: A display assembly, includes: a first substrate and a second substrate that are disposed opposite, a first liquid crystal layer located between the first substrate and the second substrate, a third substrate disposed at a side of the first substrate away from the second substrate, a second liquid crystal layer located between the first substrate and the third substrate, a first pixel circuit layer disposed between the first substrate and the first liquid crystal layer, a second pixel circuit layer disposed between the third substrate and the second liquid crystal layer, a polarizing device disposed on a side of the second pixel circuit layer away from the second liquid crystal layer, and a first metal wire grid polarizing layer disposed between the first substrate and the first pixel circuit layer. The first metal wire grid polarizing layer is electrically insulated from the first pixel circuit layer.

公开(公告)号：US20220199862A1

公开(公告)日：2022-06-23

申请号：US17279488

申请日：2020-05-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Guoqiang WANG ,  Muxin DI ,  Ke WANG ,  Hsuanwei MAI ,  Zhanfeng CAO

IPC: H01L33/44 ,  H01L27/15

Abstract: Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

公开(公告)号：US20220037621A1

公开(公告)日：2022-02-03

申请号：US17279872

申请日：2020-07-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jinxiang XUE ,  Guoqiang WANG ,  Zhongyuan SUN ,  Wenqi LIU ,  Jingkai NI ,  Kai SUI ,  Xiaofen WANG ,  Xiang ZHOU ,  Chao DONG ,  Guangcai YUAN

IPC: H01L51/52 ,  H01L27/32

Abstract: A display substrate has at least one display region and at least one non-display region, and a non-display region is located at at least one side of a display region. The display substrate includes a base, a plurality of light-emitting devices, and an encapsulation layer. The plurality of light-emitting devices are located in the at least one display region and disposed on a side of the base. The encapsulation layer is disposed on a side of the plurality of light-emitting devices facing away from the base, and configured to encapsulate the plurality of light-emitting devices. A surface, proximate to the base, of a portion of the encapsulation layer located in the non-display region is unevenly arranged.