公开(公告)号：US20150348896A1

公开(公告)日：2015-12-03

申请号：US14518066

申请日：2014-10-20

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shou LI ,  Hong Wang ,  Jung Chul Gyu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00014

Abstract: The present disclosure of the present invention provides a chip on film and a display apparatus. The chip on film comprises a substrate having an input end lead and an output end lead, a region where the input end lead is located and a region where the output end lead is located are defined as a binding region, wherein the maximum thickness of the binding region is larger than the maximum thickness of other parts of the substrate than the binding region.

Abstract translation: 本发明的公开内容提供了一种胶片芯片和显示装置。 膜上的芯片包括具有输入端引线和输出端引线的基板，输入端引线所在的区域和输出端引线所在的区域被定义为绑定区域，其中， 结合区域比结合区域大于其他部分的最大厚度。