公开(公告)号：US20210264852A1

公开(公告)日：2021-08-26

申请号：US17254088

申请日：2020-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Renquan GU ,  Qi YAO ,  Jaiil RYU ,  Yingwei LIU ,  Zhiwei LIANG ,  Muxin DI ,  Wusheng LI

IPC: G09G3/3225 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.

公开(公告)号：US20210234137A1

公开(公告)日：2021-07-29

申请号：US16769374

申请日：2019-10-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei HE ,  Huili WU ,  Shipei LI ,  Dongsheng LI ,  Fang HE ,  Renquan GU ,  Sheng XU ,  Dongsheng YIN ,  Wusheng LI ,  Qi YAO

IPC: H01L51/56 ,  H01L51/00

Abstract: The present disclosure relates to a method of fabricating a flexible display panel. The method of fabricating the flexible display panel may include forming a photosensitive layer comprising at least one azo group on a carrier substrate; forming a flexible substrate on the photosensitive layer; irradiating the photosensitive layer with ultraviolet light; and peeling off the flexible substrate from the carrier substrate.

公开(公告)号：US20210159363A1

公开(公告)日：2021-05-27

申请号：US16824062

申请日：2020-03-19

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Sheng XU ,  Huili WU ,  Lizhen ZHANG ,  Wei HE ,  Xuefei ZHAO ,  Shipei LI ,  Fang HE ,  Dongsheng YIN ,  Renquan GU ,  Wusheng LI ,  Qi YAO

IPC: H01L33/38 ,  H01L33/24 ,  H01L25/075

Abstract: A drive backboard, a manufacturing method thereof, a display panel and a display device are provided. The drive backboard includes a plurality of pixel units and a plurality of spare electrode groups. Each pixel unit includes m subpixel units, and m is a positive integer greater than or equal to 2. Each spare electrode group includes two first spare electrodes and one second spare electrode; two adjacent ith subpixel units respectively use one first spare electrode in each spare electrode group and share one second spare electrode in each spare electrode group, where i is a positive integer from 1 to m.

公开(公告)号：US20210158007A1

公开(公告)日：2021-05-27

申请号：US17041516

申请日：2020-04-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei LI ,  Ying ZHAO ,  Renquan GU ,  Wei HE ,  Huili WU ,  Dongsheng YIN ,  Sheng XU ,  Lizhen ZHANG ,  Xuefei ZHAO ,  Fang HE ,  Yupeng GAO

IPC: G06K9/00 ,  H01L27/146

Abstract: Disclosed are a fingerprint recognition sensor, a manufacturing method, and a display device. The fingerprint recognition sensor includes a base substrate, a thin film transistor, on a side of the base substrate; and a photosensitive element, on a side of the base substrate away from the thin film transistor, the thin film transistor, the base substrate, and the photosensitive element are sequentially stacked in a thickness direction perpendicular to the base substrate, the base substrate includes a conductive structure penetrating through the base substrate in the thickness direction perpendicular to the base substrate, and the photosensitive element is connected with the thin film transistor through the conductive structure.