Optoelectronic component having a plurality of current expansion layers and method for producing it
    31.
    发明申请
    Optoelectronic component having a plurality of current expansion layers and method for producing it 有权
    具有多个电流膨胀层的光电子部件及其制造方法

    公开(公告)号:US20050253163A1

    公开(公告)日:2005-11-17

    申请号:US11120514

    申请日:2005-05-02

    摘要: An optoelectronic component having a semiconductor chip containing a semiconductor layer sequence (6) with a radiation-emitting active zone (4), the semiconductor layer sequence (6) having sidewalls (10). A connection contact (9) is provided for impressing current into the active zone. A first current expansion layer (7) adjoins a semiconductor layer (5) of the semiconductor layer sequence (6) and a second current expansion layer (8) is provided between the semiconductor layer sequence (6) and the connection contact (9). The first current expansion layer (7) has a larger sheet resistance than the second current expansion layer (8) and forms an ohmic contact with the adjoining semiconductor layer (5). The second current expansion layer (8) is applied to a partial region of the first current expansion layer (7) which is at a distance from the sidewalls (10).

    摘要翻译: 一种具有半导体芯片的光电子元件,该半导体芯片包含具有辐射发射有源区(4)的半导体层序列(6),该半导体层序列(6)具有侧壁(10)。 提供连接触点(9),用于将电流施加到活动区域中。 第一电流膨胀层(7)邻接半导体层序列(6)的半导体层(5),并且在半导体层序列(6)和连接触头(9)之间设置第二电流扩展层(8)。 第一电流膨胀层(7)具有比第二电流膨胀层(8)更大的薄层电阻,并与邻接的半导体层(5)形成欧姆接触。 第二电流膨胀层(8)被施加到距离侧壁(10)一定距离的第一电流膨胀层(7)的部分区域。