公开(公告)号：US20210282301A1

公开(公告)日：2021-09-09

申请号：US16928279

申请日：2020-07-14

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mandy Hin Lam ,  Mark Nowell ,  Rakesh Chopra

IPC: H05K7/20 ,  F28F13/00

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

公开(公告)号：US20210235597A1

公开(公告)日：2021-07-29

申请号：US16922177

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: H05K7/20 ,  H05K7/14

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US10945357B2

公开(公告)日：2021-03-09

申请号：US16282127

申请日：2019-02-21

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Chopra ,  Mandy Hin Lam

IPC: H05K7/20 ,  H05K9/00 ,  G02B6/42

Abstract: In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.

公开(公告)号：US09992310B2

公开(公告)日：2018-06-05

申请号：US15077061

申请日：2016-03-22

Applicant: Cisco Technology, Inc.

Inventor： Kuralvanan Arangasamy ,  Brian Eliot Weis ,  Rakesh Chopra ,  Hugo J. W. Vliegen

IPC: H04L12/28 ,  H04L29/06 ,  H04L12/46

CPC classification number: H04L69/22 ,  H04L12/28 ,  H04L12/4633 ,  H04L63/0428 ,  H04L63/162 ,  H04L63/164

Abstract: An egress frame processing method, an Ethernet frame is received. Information defining an Internet Protocol (IP) tunnel between the network device and a peer network device over a public wide area network is determined. A media access control security (MACsec) policy that defines how to protect the Ethernet frame is determined based on the information defining the IP tunnel. The Ethernet frame is protected according to the MACsec policy. The following fields are appended to the protected Ethernet frame: (i) an unprotected layer 3 (L3) encapsulation identifying a layer 2 (L2)-over-L3 tunnel protocol; (ii) an unprotected IP header corresponding to the IP tunnel; and (iii) an unprotected outer Ethernet header, to produce a partly protected egress frame. The partly protected egress frame is transmitted to the peer network device over the IP tunnel of the public wide area network.