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公开(公告)号：US20220225537A1
公开(公告)日：2022-07-14
申请号：US17145816
申请日：2021-01-11
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mark Nowell , M. Baris Dogruoz , Mandy Hin Lam , Rakesh Chopra
Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.
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公开(公告)号：US20200093031A1
公开(公告)日：2020-03-19
申请号：US16131629
申请日：2018-09-14
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz
Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.
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公开(公告)号：US10582639B1
公开(公告)日：2020-03-03
申请号：US16131629
申请日：2018-09-14
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz
Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.
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公开(公告)号：US11762380B2
公开(公告)日：2023-09-19
申请号：US17813692
申请日：2022-07-20
Applicant: Cisco Technology, Inc.
Inventor： Mark A. Gustlin , Richard J. Wong , Rakesh Chopra
CPC classification number: G05B23/0283 , G05B23/0232 , H05K7/20836
Abstract: Embodiments herein describe coupling traditional fan and shaper control along with aggregated knowledge of the temperature history of a hardware device to optimally manage the temperature of the hardware device to preserve its expected life while also providing the lower power, best performing solution possible. In one embodiment, a cooling application manages the expected life by trading off performance and power versus temperature to achieve a desired (or accepted) lifetime. In one embodiment, the cooling application calculates a historical temperature value for the hardware device which is then used to determine the expected life of the hardware device.
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公开(公告)号：US11429093B2
公开(公告)日：2022-08-30
申请号：US16723882
申请日：2019-12-20
Applicant: Cisco Technology, Inc.
Inventor： Mark A. Gustlin , Richard J. Wong , Rakesh Chopra
Abstract: Embodiments herein describe coupling traditional fan and shaper control along with aggregated knowledge of the temperature history of a hardware device to optimally manage the temperature of the hardware device to preserve its expected life while also providing the lower power, best performing solution possible. In one embodiment, a cooling application manages the expected life by trading off performance and power versus temperature to achieve a desired (or accepted) lifetime. In one embodiment, the cooling application calculates a historical temperature value for the hardware device which is then used to determine the expected life of the hardware device.
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Patent Agency Ranking
公开(公告)号：US20200275587A1
公开(公告)日：2020-08-27
申请号：US16282127
申请日：2019-02-21
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rakesh Chopra , Mandy Hin Lam
Abstract: In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.
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公开(公告)号：US20200163251A1
公开(公告)日：2020-05-21
申请号：US16749254
申请日：2020-01-22
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz , Joel Richard Goergen
IPC: H05K7/20
Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.
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公开(公告)号：US09967372B2
公开(公告)日：2018-05-08
申请号：US15077052
申请日：2016-03-22
Applicant: Cisco Technology, Inc.
Inventor： Kuralvanan Arangasamy , Brian Eliot Weis , Rakesh Chopra , Hugo J. W. Vliegen
IPC: H04L12/741 , H04L29/06 , H04L12/28 , H04L12/46
CPC classification number: H04L69/22 , H04L12/28 , H04L12/4633 , H04L63/0428 , H04L63/162 , H04L63/164
Abstract: In an egress processing method, an egress frame is received. The egress frame includes an outer Ethernet frame, an Internet Protocol (IP) header, a layer 3 (L3) encapsulation identifying a layer 2 (L2)-over-L3 tunnel protocol, and an inner Ethernet frame with a payload. The outer Ethernet frame, the IP header, and the inner Ethernet frame, and the L3 encapsulation are parsed. Based on results of the parsing, a media access control security (MACsec) policy that defines how to protect the inner Ethernet frame is determined, and the inner Ethernet frame is protected according to the MACsec policy, while leaving unprotected the outer Ethernet frame, the IP header, and the L3 encapsulation, to produce a partly protected output egress frame. The partly protected output egress frame is transmitted to the peer network device over a public wide area network.
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公开(公告)号：US20170230185A1
公开(公告)日：2017-08-10
申请号：US15386120
申请日：2016-12-21
Applicant: Cisco Technology, Inc.
Inventor： Kannan Varadhan , Chirag Shroff , Rakesh Chopra
CPC classification number: H04L9/3263 , G06F8/63 , G06F8/65 , G06F21/121 , G06F21/44 , H04L9/14 , H04L9/30 , H04L63/0823 , H04L63/123 , H04L63/126
Abstract: In one embodiment, a computing device receives an image that has been signed with a first key, wherein the image includes a first computational value associated with it. A second computational value associated with the image is determined and the image is signed with a second key to produce a signed image that includes both the first and second computational values. Prior to loading the dual-signed image, the computing device attempts to authenticate the dual-signed image using both the first and second computational values, and, if successful, loads and installs the dual-signed image.
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公开(公告)号：US20170104851A1
公开(公告)日：2017-04-13
申请号：US15077061
申请日：2016-03-22
Applicant: Cisco Technology, Inc.
Inventor： Kuralvanan Arangasamy , Brian Eliot Weis , Rakesh Chopra , Hugo J.W. Vliegen
IPC: H04L29/06 , H04L12/741 , H04L12/28 , H04L29/08
CPC classification number: H04L69/22 , H04L12/28 , H04L12/4633 , H04L63/0428 , H04L63/162 , H04L63/164
Abstract: An egress frame processing method, an Ethernet frame is received. Information defining an Internet Protocol (IP) tunnel between the network device and a peer network device over a public wide area network is determined. A media access control security (MACsec) policy that defines how to protect the Ethernet frame is determined based on the information defining the IP tunnel. The Ethernet frame is protected according to the MACsec policy. The following fields are appended to the protected Ethernet frame: (i) an unprotected layer 3 (L3) encapsulation identifying a layer 2 (L2)-over-L3 tunnel protocol; (ii) an unprotected IP header corresponding to the IP tunnel; and (iii) an unprotected outer Ethernet header, to produce a partly protected egress frame. The partly protected egress frame is transmitted to the peer network device over the IP tunnel of the public wide area network.
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