Abstract:
A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray or radiation to pattern exposure of the adhesive layer to provide a high adhesive region and a low adhesive region in the adhesive layer, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching the first surface of the treated member from the adhesive layer of the adhesive support.
Abstract:
Provide is a lithographic printing plate precursors having excellent printing durability, staining resistance and developability as well as processes for preparing lithographic printing plates therefrom.A lithographic printing plate precursor comprising a primer layer and an image-recording layer in this order in a substrate, wherein the primer layer comprises a polymer containing a repeat unit having a carbon-carbon backbone, a —C(═O)— group directly attached thereto, a —C(═O)—NR0— group, a carboxyl group or a salt thereof, and an ethylenically unsaturated bond.