摘要:
Apparatus and methods are provided for repairing semiconductor memory devices having an open bit line sense amplifier architecture with cell array blocks having memory blocks formed of edge sub-blocks, main sub-blocks, dummy sub-blocks. Row defects can be processed using a straight edge block when DQ data are outputted by enabling three word lines such that a repair process for the memory device in an edge sub-block or a dummy sub-block has the same repair efficiency as that of a case where defects occur in a main sub-block.
摘要:
An integrated circuit memory device includes a plurality of memory cells arranged in an array of rows and columns, a plurality of word lines wherein each of the word lines is associated with a predetermined row of the memory cells, and a plurality of common lines wherein each of the column lines is associated with a predetermined column of the memory cells. Each of a plurality of sense amplifiers is associated with a respective column line and each of the sense amplifiers detects a voltage difference between a pair of bit lines for the respective column and amplifies the voltage difference. A row decoder selects one of the word lines in response to a row address input during a write operation. An input/output driver receives data input during the write operation, and each of a plurality of input/output gates is connected between the input/output driver and a respective one of the column lines. A column decoder activates one of the input/output gates before the sense amplifier senses and amplifies the voltage difference. Related methods are also disclosed.
摘要:
A semiconductor memory device uses three different power supply voltage levels including an internal IVcc, ground Vss and a boosted level Vpp more positive than the internal Vcc. A precharge control circuit in the memory device includes at least one NMOS transistor, at least one PMOS transistor and an output node having voltage values ranging from the IVcc either to Vss or to Vpp. The NMOS transistor acts as a loading transistor to the PMOS transistor and prevents latch-up in the PMOS transistor by maintaining IVcc below Vpp during the initial power set-up period of the memory device.