摘要:
A disassembling method is disclosed for a process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus. The process cartridge includes covering members connected to a drum supporting frame and a developer container at ends of the drum supporting frame and the developer accommodating container with respect to a longitudinal direction of the electrophotographic photosensitive drum. The disassembling method includes a step of cutting the cover member adjacent to a connecting portion between the cover member and the drum supporting frame and a connecting portion between the cover member and the developer accommodating container along an outer wall of the covering member.
摘要:
This invention relates to developing agent supply container for supplying a developing agent to a developing agent storage container for storing the developing agent used for developing a latent image formed on an electrophotographic photosensitive body. The container includes a developing agent storage portion, and an inhibition device for inhibiting supply of the developing agent stored in the developing agent storage portion to the developing agent storage container when the developing agent supply container is removed from a predetermined position, and permitting supply of the developing agent stored in the developing agent storage portion to the developing agent storage container when the developing agent supply container is mounted at the predetermined position with respect to the developing agent storage container so as to supply the developing agent to the developing agent storage container.
摘要:
An electronic instrument comprises a printed circuit substrate on which electrical parts are actually mounted, a frame placed on the front side of the printed circuit substrate and having openings at least at positions corresponding to the electrical parts, a front sheet disposed at a position opposed to the printed circuit substrate with the frame interposed therebetween and provided with an adhesion margin on the peripheral portion thereof, a back sheet disposed on the back side of the printed circuit substrate and provided with an adhesion margin on the peripheral portion thereof, and an adhesive agent applied to the adhesion margins of the front sheet and the back sheet to cause the printed circuit substrate and the frame to be sandwiched between the front sheet and the back sheet.