摘要:
The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.
摘要:
A sheet conveying device such as a feed mechanism includes a pick-up roller and a cover member. The pick-up roller feeds, into an apparatus, a sheet such as a document on a placing table such as a document placing table on which the sheet is placed. The cover member such as a pick-up cover covers the pick-up roller. The cover member is supported at both ends thereof on a shaft of the pick-up roller or on shaft bearings that receive the shaft of the pick-up roller.
摘要:
An object of the present invention is to provide an adhesive layer forming liquid about which deterioration in adhesive-layer-forming capability with the passage of time can be restrained and further the smoothness of an adhesive layer surface can be certainly kept. The adhesive layer forming liquid of the present invention is an adhesive layer forming liquid, which is a liquid for forming an adhesive layer for bonding copper and a resin to each other, and which is an aqueous solution comprising an acid, a stannic salt, a complexing agent, a stabilizer, and a complexing restrainer for restraining a complexing reaction between the complexing agent and copper.