公开(公告)号：US11845108B2

公开(公告)日：2023-12-19

申请号：US16827097

申请日：2020-03-23

申请人： FUJIFILM SONOSITE, INC.

发明人： N. Christopher Chaggares ,  Eric Rieder

IPC分类号： B06B1/06 ,  H10N30/063 ,  H10N30/87 ,  B06B1/02 ,  H05K1/02 ,  H05K3/06 ,  H05K3/32 ,  H05K1/18 ,  H05K3/02 ,  H05K3/30

CPC分类号： B06B1/0629 ,  B06B1/0207 ,  B06B1/0622 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/189 ,  H05K3/02 ,  H05K3/064 ,  H05K3/305 ,  H05K3/32 ,  H10N30/063 ,  H10N30/875 ,  H05K2203/0361

摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

公开(公告)号：US20230156923A1

公开(公告)日：2023-05-18

申请号：US17916344

申请日：2021-02-16

申请人： SANKEI GIKEN KOGYO CO., LTD.

发明人： Toshiyuki Kitamura ,  Daiji Hasegawa ,  Toshio Okabe

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K1/02

CPC分类号： H05K3/0035 ,  H05K3/38 ,  H05K1/02 ,  H05K2203/0361

摘要： A plated molded article 1 is characterized in that a partial region R in a surface 21 of a base material 2 is provided with a plurality of non-penetrating holes 4 of substantially corresponding shapes and substantially corresponding sizes that are formed in a scattered pattern in such a manner as to be separated from each other at a substantially averaged hole density, and a plated part 3 is formed while filling the non-penetrating holes 4 and is provided continuously over the partial region R in such a manner as to extend across the non-penetrating holes 4. It is possible to obtain a plated molded article capable of forming a required plated part in a short time on a surface of a base material and capable of improving smoothness of an outer surface of the plated part and adhesion property of the plated part.

公开(公告)号：US20170197232A1

公开(公告)日：2017-07-13

申请号：US15418483

申请日：2017-01-27

申请人： FUJIFILM SonoSite, Inc.

发明人： N. Christopher Chaggares ,  Eric Rieder

IPC分类号： B06B1/06 ,  H05K3/30 ,  H05K3/02 ,  H05K1/18

CPC分类号： B06B1/0629 ,  B06B1/0207 ,  B06B1/0622 ,  H01L41/0475 ,  H01L41/293 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/189 ,  H05K3/02 ,  H05K3/064 ,  H05K3/305 ,  H05K3/32 ,  H05K2203/0361

摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

公开(公告)号：US09596765B2

公开(公告)日：2017-03-14

申请号：US14426364

申请日：2012-09-11

申请人： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

发明人： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  C25D7/06 ,  H05K1/09 ,  H05K3/40 ,  H01L23/544 ,  H01L21/683 ,  H05K1/02 ,  H01L21/56

CPC分类号： H05K3/0008 ,  C25D7/0607 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/185 ,  H05K1/188 ,  H05K3/305 ,  H05K3/4007 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  H01L2924/00

摘要： A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

摘要翻译： 根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成 在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成 参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。

公开(公告)号：US20160105973A1

公开(公告)日：2016-04-14

申请号：US14974404

申请日：2015-12-18

申请人： California Institute of Technology

发明人： Yu-Chong Tai ,  Han-Chieh Chang ,  Xiaoxiao Zhang

IPC分类号： H05K3/24 ,  H05K3/06 ,  C25D1/04 ,  A61N1/05 ,  C23C14/14 ,  C23C14/24

CPC分类号： H05K3/242 ,  A61N1/0543 ,  C23C14/14 ,  C23C14/24 ,  C25D1/04 ,  H05K1/189 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4007 ,  H05K2203/0191 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1338

摘要： Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.

摘要翻译： 描述了通过该方法产生的用于电镀多个在电缆或其它设备上彼此电隔离的微尺度电极的方法和装置。 通过在局部区域上沉积金属片或其它导电材料，将电缆的另一端上的局部连接区域短路在一起。 金属片与电源的端子连接，将电缆的电极端浸渍在电解液中，通过电镀电沉积。 在电极电镀之后，将金属片从电缆中取出，以便重新隔离电极。

公开(公告)号：US20150216050A1

公开(公告)日：2015-07-30

申请号：US14680463

申请日：2015-04-07

申请人： IBIDEN CO., LTD.

发明人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K3/34 ,  H05K1/02

CPC分类号： H05K1/112 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/113 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

摘要翻译： 印刷电路板包括树脂绝缘层，该树脂绝缘层具有在第一表面的相对侧上的第一表面和第二表面，树脂绝缘层具有用于通路导体的开口，形成在树脂绝缘层的第一表面上的焊盘 并且提供用于安装电子部件，形成在树脂绝缘层的第二表面上的导电电路和形成在开口中并连接焊盘和导电电路的通孔导体。 垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。

公开(公告)号：US08658905B2

公开(公告)日：2014-02-25

申请号：US13070094

申请日：2011-03-23

申请人： Shinnosuke Maeda ,  Tatsuya Ito ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Tatsuya Ito ,  Satoshi Hirano

IPC分类号： H05K1/03

CPC分类号： H05K3/244 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/099 ,  H05K2203/0361 ,  H01L2924/00

摘要： In a wiring laminate portion of a multilayer wiring substrate, a solder resist layer having a plurality of openings is disposed on a main surface side of the laminate structure, and connection terminals are embedded in an outermost resin insulation layer in contact with the solder resist layer. Each of the connection terminals comprises a copper layer and a metallic layer formed of at least one type of metal other than copper. A main-surface-side circumferential portion of the copper layer is covered by the solder resist layer. At least a portion of the metallic layer is located in a recess in a main-surface-side central portion of the copper layer. At least a portion of the metallic layer is exposed via a corresponding opening.

摘要翻译： 在多层布线基板的布线层叠部分中，具有多个开口的阻焊层设置在层叠结构的主表面侧，并且连接端子嵌入在与阻焊层接触的最外层树脂绝缘层中 。 每个连接端子包括铜层和由铜以外的至少一种类型的金属形成的金属层。 铜层的主表面侧圆周部分被阻焊层覆盖。 金属层的至少一部分位于铜层的主表面侧中央部的凹部中。 金属层的至少一部分经由相应的开口露出。

公开(公告)号：US08525356B2

公开(公告)日：2013-09-03

申请号：US12968405

申请日：2010-12-15

申请人： Junichi Nakamura ,  Kazuhiro Kobayashi

发明人： Junichi Nakamura ,  Kazuhiro Kobayashi

IPC分类号： H01L23/544

CPC分类号： H05K3/10 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0269 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4682 ,  H05K2201/09918 ,  H05K2203/025 ,  H05K2203/0361 ,  H05K2203/1152 ,  Y10T29/49155 ,  H01L2924/00

摘要： A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.

摘要翻译： 所公开的布线基板包括绝缘层，形成在绝缘层的表面上的凹部和形成在凹部内部的对准标记，其中对准标记的表面被粗糙化，从绝缘层的表面凹陷， 从凹槽露出。

公开(公告)号：US20130140955A1

公开(公告)日：2013-06-06

申请号：US13657783

申请日：2012-10-22

申请人： N. Christopher Chaggares ,  Eric Reider

发明人： N. Christopher Chaggares ,  Eric Reider

IPC分类号： H01L41/047 ,  H01L41/293 ,  B06B1/06

CPC分类号： B06B1/0629 ,  B06B1/0207 ,  B06B1/0622 ,  H01L41/0475 ,  H01L41/293 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/189 ,  H05K3/02 ,  H05K3/064 ,  H05K3/305 ,  H05K3/32 ,  H05K2203/0361

摘要： The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

摘要翻译： 所公开的技术具有用于制造诸如超声换能器的电气部件的方法。 特别地，所公开的技术提供了通过将一个或多个多层印刷电路连接到超声换能器元件阵列来产生超声换能器的方法。 在一个实施例中，印刷电路在单层中具有间隔距离大于多层印刷电路要连接的换能器元件的间距的迹线。 然而，多层印刷电路中的所有层的迹线被交织以具有等于换能器元件的间距的间距。 所公开的技术还具有通过本文所述的方法产生的超声换能器。

公开(公告)号：US08258409B2

公开(公告)日：2012-09-04

申请号：US12058040

申请日：2008-03-28

申请人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

发明人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

IPC分类号： H05K1/00

CPC分类号： H05K3/383 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/056 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1152 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

摘要翻译： 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。