公开(公告)号：US10693033B2

公开(公告)日：2020-06-23

申请号：US16452015

申请日：2019-06-25

Applicant: OSRAM OLED GMBH

Inventor： Alfred Lell ,  Andreas Löffler ,  Christoph Eichler ,  Bernhard Stojetz ,  André Somers

IPC: H01L33/00 ,  H01L21/687 ,  H01L33/26 ,  H01L21/67 ,  H01L33/62 ,  H01S5/10 ,  H01S5/22 ,  H01S5/40 ,  H01S5/32 ,  H01S5/026 ,  H01S5/20 ,  H01S5/227 ,  H01L33/32 ,  H01S5/323

Abstract: A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).