公开(公告)号：US20180040781A1

公开(公告)日：2018-02-08

申请号：US15788645

申请日：2017-10-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BINDER ,  Alexander LINKOV ,  Thomas ZEILER ,  Peter BRICK

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/44

Abstract: An optoelectronic semiconductor component comprising a connection carrier with a mounting face and an electrically insulating base member. An optoelectronic semiconductor chip is arranged on the mounting face of the connection carrier. A radiation-transmissive body having four side faces is provided. The radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner. The radiation-transmissive body comprises at least one side face which extends at least in places at an angle of between 60° and 70° to the mounting face. The base member has a thickness which amounts to at most 250 μm.