公开(公告)号：US20220256664A1

公开(公告)日：2022-08-11

申请号：US17612896

申请日：2020-06-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BINDER ,  Holger SPECHT ,  Maximilian TAUER

IPC: H05B45/14 ,  H05B45/58

Abstract: A method for operating a light emitting diode arrangement with at least one light emitting diode includes the steps of: a) determining at least one instantaneous current-voltage value pair; b) matching the instantaneous current-voltage value pair with an original current-voltage value pair; and c) determining an updated current feed based on the matching and driving the light emitting diode with the updated current feed.

公开(公告)号：US20180375002A1

公开(公告)日：2018-12-27

申请号：US16072865

申请日：2017-01-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas LOEFFLER ,  Adam BAUER ,  Matthias PETER ,  Michael BINDER

IPC: H01L33/50 ,  H01L33/06 ,  H01L33/24 ,  H01L33/22 ,  H01L33/00 ,  H01L33/32

Abstract: Disclosed is a conversion element (1) comprising an active region (13) that is formed by a semiconductor material and includes a plurality of barriers (131) and quantum troughs (132), a plurality of first structural elements (14) on a top face (la) of the conversion element (1), and a plurality of second structural elements (15) and/or third structural elements (16) which are arranged on a face of the active region (13) facing away from the plurality of first structural elements (14). Also disclosed is a method for producing a conversion element of said type.

公开(公告)号：US20180040781A1

公开(公告)日：2018-02-08

申请号：US15788645

申请日：2017-10-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BINDER ,  Alexander LINKOV ,  Thomas ZEILER ,  Peter BRICK

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/44

Abstract: An optoelectronic semiconductor component comprising a connection carrier with a mounting face and an electrically insulating base member. An optoelectronic semiconductor chip is arranged on the mounting face of the connection carrier. A radiation-transmissive body having four side faces is provided. The radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner. The radiation-transmissive body comprises at least one side face which extends at least in places at an angle of between 60° and 70° to the mounting face. The base member has a thickness which amounts to at most 250 μm.

公开(公告)号：US20230125745A1

公开(公告)日：2023-04-27

申请号：US17774870

申请日：2020-10-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BINDER ,  Andreas RÜCKERL ,  Roland ZEISEL

IPC: H01L33/14 ,  H01L33/00 ,  H01L25/075 ,  H01L33/44 ,  H01L33/62 ,  H01L33/38

Abstract: An optoelectronic component may include a support and multiple optoelectronic semiconductor chips that can be actuated individually and independently of one another. Each semiconductor chip may include a semiconductor layer sequence. Each semiconductor chip may have an electrically insulating passivation layer on the respective lateral surface of the semiconductor layer sequence. The semiconductor chip(s) are assigned to a first group, which may be paired with a common boundary field generating device arranged on the passivation layer face facing away from the semiconductor layer sequence at an active zone for each semiconductor chip of the first group. The boundary field generating device is designed to at least temporarily generate an electric field in the boundary regions of the active zone so that a flow of current through the semiconductor layer sequences can be controlled in the boundary regions during the operation of the semiconductor chips of the first group.