公开(公告)号：US11289794B2

公开(公告)日：2022-03-29

申请号：US16859009

申请日：2020-04-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Rung-Jeng Lin ,  Han-Hung Chen ,  Shi-Min Zhou ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H05K7/00 ,  H01Q1/22 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

公开(公告)号：US20220068663A1

公开(公告)日：2022-03-03

申请号：US17068988

申请日：2020-10-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L21/48 ,  H01L23/498

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US10510720B2

公开(公告)日：2019-12-17

申请号：US15372638

申请日：2016-12-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-Fu Lin ,  Chin-Tsai Yao ,  Kuo-Hua Yu ,  Fu-Tang Huang

IPC: H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic package is provided, which includes: a first substrate; a first electronic component disposed on the first substrate; a second substrate stacked on the first substrate through a plurality of first conductive elements and a plurality of second conductive elements and bonded to the first electronic component through a bonding layer; and a first encapsulant formed between the first substrate and the second substrate. The first conductive elements are different in structure from the second conductive elements so as to prevent a mold flow of the first encapsulant from generating an upward pushing force during a molding process and hence avoid cracking of the second substrate. The present disclosure further provides a method for fabricating the electronic package.

公开(公告)号：US20190273321A1

公开(公告)日：2019-09-05

申请号：US15993243

申请日：2018-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Chun-Yi Huang ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Kuo-Hua Yu

IPC: H01Q9/04 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H01Q1/22

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.