APPARATUS AND METHOD FOR POLISHING AND STRENGTHENING SUBSTRATE
    31.
    发明申请
    APPARATUS AND METHOD FOR POLISHING AND STRENGTHENING SUBSTRATE 审中-公开
    抛光和加强基材的装置和方法

    公开(公告)号:US20150144593A1

    公开(公告)日:2015-05-28

    申请号:US14302227

    申请日:2014-06-11

    IPC分类号: B24B17/08 C03C15/02 B24B1/00

    CPC分类号: B24B17/08 B24B1/00 C03C15/02

    摘要: An apparatus and method for polishing and strengthening a substrate are disclosed. In one aspect, the apparatus includes a table on which a substrate is placed, a powder supply portion for polishing a surface of the substrate, a substance supply portion, and an injector. The powder supply portion is placed over the table. The substance supply portion is configured to supply a substance onto the polished surface of the substrate. The injector is configured to inject the powder from the powder supply portion onto the surface of the substrate and the substance from the substance supply portion onto the polished surface of the substrate.

    摘要翻译: 公开了一种用于抛光和强化衬底的装置和方法。 一方面,该装置包括:放置基板的台,用于研磨基板的表面的粉末供给部,物质供给部和喷射器。 粉末供应部分放置在桌子上。 物质供给部被配置为将物质供给到基板的抛光表面上。 注射器被构造成将粉末从粉末供应部分注入到基材表面上,物质从物质供应部分喷射到基材的抛光表面上。