公开(公告)号：US11043446B2

公开(公告)日：2021-06-22

申请号：US16662360

申请日：2019-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungsoo Park ,  Kyoungmoo Harr ,  Jihyun Lee ,  Doohwan Lee ,  Junggon Choi

IPC: H01L29/06 ,  H01L21/44 ,  H01L23/495 ,  H01L23/367 ,  H01L23/48

Abstract: A semiconductor package includes a connection structure including a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a first connection via penetrating through the first insulating layer and connected to the first redistribution layer, a semiconductor chip disposed on the connection structure, an encapsulant covering at least a portion of the semiconductor chip, a second insulating layer disposed on the encapsulant, a second redistribution layer including a signal line disposed on the encapsulant, and a heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line.

公开(公告)号：US20210183817A1

公开(公告)日：2021-06-17

申请号：US16940045

申请日：2020-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doohwan Lee ,  Jungsoo Byun

IPC: H01L25/065 ,  H01L23/04 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31

Abstract: A semiconductor package includes a frame having a through-opening, a first semiconductor chip disposed in the through-opening and having a first active surface on which a first connection pad is disposed and a first inactive surface opposing the first active surface, a second semiconductor chip disposed on the first semiconductor chip and having a second active surface on which a second connection pad is disposed and a second inactive surface opposing the second active surface, first and second bumps electrically connected to the first and second connection pads, respectively, first and second dummy bumps disposed on a same level as levels of the first and second bumps, respectively, first and second posts electrically connected to the first and second bumps, respectively, a connection member including a redistribution layer electrically connected to each of the first and second posts, and a dummy post disposed between the frame and the connection member.

公开(公告)号：US20200161204A1

公开(公告)日：2020-05-21

申请号：US16681320

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonsung Kim ,  Doohwan Lee ,  Jinseon Park

IPC: H01L23/31 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a semiconductor chip, an encapsulant covering the semiconductor chip, a connection structure disposed below the semiconductor chip, and first and second metal pattern layers disposed on different levels on the semiconductor chip, wherein the first metal pattern layer is provided to electrically connect to an electrical connection member such as a frame, provided for electrical connection of the package in a vertical direction by a path via the second metal pattern layer.