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    Semiconductor package
    31.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11244921B2

    公开(公告)日：2022-02-08

    申请号：US16723588

    申请日：2019-12-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Chang Eun Joo ,  Sung Hoan Kim ,  Kyung Moon Jung ,  Yong Hwan Kwon ,  Young Kyu Lim ,  Seong Hwan Park

    IPC: H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31

    Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.

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