公开(公告)号：US20200335468A1

公开(公告)日：2020-10-22

申请号：US16713143

申请日：2019-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyu Jin Choi ,  Sung Hoan Kim ,  Chang Eun Joo ,  Chil Woo Kwon ,  Young Kyu Lim ,  Sung Uk Lee

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31

Abstract: A semiconductor package includes: a semiconductor chip including a body having a first surface and a second surface, opposing the first surface, a connection pad disposed on the first surface of the body, and an extension pad disposed on the connection pad; and a connection structure including an insulating layer disposed on the first surface of the body of the semiconductor chip, a redistribution via penetrating through the insulating layer and having one side thereof in contact with the extension pad, and a redistribution layer disposed on the insulating layer and having a via pad in contact with the other side of the redistribution via, wherein a horizontal cross-sectional area of extension pad of the semiconductor chip is greater than a horizontal cross-sectional area of the connection pad of the semiconductor chip.

公开(公告)号：US11244921B2

公开(公告)日：2022-02-08

申请号：US16723588

申请日：2019-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Eun Joo ,  Sung Hoan Kim ,  Kyung Moon Jung ,  Yong Hwan Kwon ,  Young Kyu Lim ,  Seong Hwan Park

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31

Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.

公开(公告)号：US11171107B2

公开(公告)日：2021-11-09

申请号：US16713143

申请日：2019-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyu Jin Choi ,  Sung Hoan Kim ,  Chang Eun Joo ,  Chil Woo Kwon ,  Young Kyu Lim ,  Sung Uk Lee

IPC: H01L23/52 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31 ,  H01L21/48

Abstract: A semiconductor package includes: a semiconductor chip including a body having a first surface and a second surface, opposing the first surface, a connection pad disposed on the first surface of the body, and an extension pad disposed on the connection pad; and a connection structure including an insulating layer disposed on the first surface of the body of the semiconductor chip, a redistribution via penetrating through the insulating layer and having one side thereof in contact with the extension pad, and a redistribution layer disposed on the insulating layer and having a via pad in contact with the other side of the redistribution via, wherein a horizontal cross-sectional area of extension pad of the semiconductor chip is greater than a horizontal cross-sectional area of the connection pad of the semiconductor chip.