摘要:
Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.
摘要:
A Metal Nanoparticle Photonic Bandgap Device in SOI Method (NC#098884). The method includes providing a substrate having a semiconductor layer over an insulator layer, operatively coupling the substrate to a photonic bandgap structure having at least one period, wherein the photonic bandgap structure is adapted to receive and output light along a predetermined path, and operatively coupling the photonic bandgap structure and the substrate to a metal nanoparticle structure comprising at least three metal nanoparticles having spherical shapes of different radii, wherein the at least three metal nanoparticles are adapted to receive and amplify light rays and output amplified light.
摘要:
Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.
摘要:
A method for providing broadcast network services from a server by providing a broadcaster with access to an application tool, a storage device, and a streaming media tool bundled together so the broadcaster can create, upload and/or store program files using the application tools, transmit the program file to the members as streaming media, and also allow the member to download auxiliary files associated with the program file, rate the content of the program file, and/or send communications to the broadcaster related to the program file.
摘要:
Methods for forming conductive vias in a substrate include oxidizing at least a portion of a metallic structure that is exposed through an opening in a substrate to form an oxidation injury in the metallic structure. The oxidation injury is at least partially reversed, and conductive material is provided within the opening in the substrate. Electronic devices and systems include at least one conductive via extending through a substrate and contacting at least one conductive interconnect structure along an interface. The conductive interconnect structure includes an at least partially reversed oxidation injury at the interface between the conductive via and the interconnect structure.
摘要:
A pipeline architecture for analyzing multiple streams of video is embodied, in part, in a layer of application program interfaces (APIs) to each stage of processing. Buffer queuing is used between some stages, which helps moderate the load on the CPU(s). Through the layer of APIs, innumerable video analysis applications can access and analyze video data flowing through the pipeline, and can annotate portions of the video data (e.g., frames and groups of frames), based on the analyses performed, with information that describes the frame or group. These annotated frames and groups flow through the pipeline to subsequent stages of processing, at which increasingly complex analyses can be performed. At each stage, portions of the video data that are of little or no interest are removed from the video data. Ultimately, “events” are constructed and stored in a database, from which cross-event and historical analyses may be performed and associations with, and among, events may be made.
摘要:
A method of identifying an object captured in a video image in a multi-camera video surveillance system is disclosed. Sets of identifying information are stored in profiles, each profile being associated with one object. The disclosed method of identifying an object includes comparing identifying information extracted from images captured by the video surveillance system to one or more stored profiles. A confidence score is calculated for each comparison and used to determine a best match between the extracted set of identifying information and an object. In one embodiment, the method is used as part of a facial recognition system incorporated into a video surveillance system.
摘要:
In damascene process integration, a reducing plasma is applied after the etch stop or barrier layer is opened over a copper layer. Currently known methods for opening barrier layers suffer from the disadvantage that they cause at least some of the underlying copper to oxidize to copper oxide.. Because copper oxide is selectively removed by subsequent wet cleaning, voids can form where damaged copper (e.g., copper oxide) is removed, thus compromising the reliability of metal-to-metal contact in vias. The present invention advantageously overcomes this and other disadvantages of the prior art through the use of a hydrogen plasma following the barrier layer opening step, which repairs damaged copper (e.g., reduces copper oxide to copper), thus preventing and/or diminishing defects in metal-to-metal contacts in vias and concomitantly improving the reliability of the same.
摘要:
Methods and devices for a plasmonic circuit are described. A planar plasmonic device is configured with a controlling gate structure and when coupled to a complementary plasmonic device, a switching circuit can be realized. Also, by varying the properties of the complementary plasmonic device, the circuit can also operate as an amplifier. By use of combinations of this plasmonic circuit element, more advanced circuits and logic functions can be arrived at.
摘要:
A distributed system and methods for web-based multimedia content including a global media hub (GMH) server computer (500) and a multiplicity of remote media asset node (MAN) server computers (510, 520, 530, 540, 550) and client computer terminals (515, 525, 535, 536, 537, 545, 555), with the client or customer computers being constructed and configured for network-based coupling to at least one of the MAN server computers for editing a browse copy of the MMC stored at the MAN. The GMH server computer includes processing component, memory for storage of all the metadata, and includes software operable thereon for orchestrating the processes that act on the MMC and metadata, including the operations and actions that are initiated by the client computer terminals for acting on the MAN-based MMC.