公开(公告)号：US4402494A

公开(公告)日：1983-09-06

申请号：US194983

申请日：1980-10-08

申请人： Atsuo Senda ,  Tohru Kasanami ,  Takuji Nakagawa

发明人： Atsuo Senda ,  Tohru Kasanami ,  Takuji Nakagawa

IPC分类号： C04B41/00 ,  C04B41/80 ,  H01G13/00 ,  C21D1/06

CPC分类号： C04B41/009 ,  C04B41/0072 ,  C04B41/80 ,  H01G13/00

摘要： A process for metallizing a copper film comprising the step of heat treating a copper film formed by an electroless plating process as opposing electrodes of a ceramic capacitor. The process comprises the steps of placing a ceramic body having a copper film formed on the surface thereof by an electroless plating process within a container sealing the same from the external atmosphere and maintaining constant the internal atmosphere, and heating the container maintaining the surrounding of the container in an inert atmosphere.