Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
    31.
    发明申请
    Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices 有权
    阻燃剂和包含其的环氧树脂组合物用于封装半导体器件

    公开(公告)号:US20060223913A1

    公开(公告)日:2006-10-05

    申请号:US11395216

    申请日:2006-04-03

    申请人: Shoichi Osada

    发明人: Shoichi Osada

    IPC分类号: C08L63/00 C08K9/10 C08G79/04

    摘要: A flame retardant comprising an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) wherein X is selected from the group consisting of a single bond, CH2, C(CH3)2, SO2, S, O, and O(CO)O, n is an integer of from 3 to 1000, d and e are numbers with 2d+e=2n, said phosphazene compound being supported on said inorganic porous fine particle, and a resin layer coating said inorganic porous fine particle with the phosphazene compound supported thereon, said resin thermally decomposing to lose weight by 10% at a temperature of from 300° C. to 500° C. as measured by thermogravimetry in the air at a heating rate of 10° C./min.

    摘要翻译: 一种阻燃剂,其包含无机多孔微粒,由以下平均组成式(1)表示的磷腈化合物,其中X选自单键,CH 2,C(CH 3) 2,SO 2,S,O和O(CO)O,n为3〜1000的整数,d和 e是2d + e = 2n的数,所述磷腈化合物负载在所述无机多孔微粒上,树脂层涂覆所述无机多孔微粒与磷腈化合物负载在其上,所述树脂热分解减少10% 通过在10℃/分钟的加热速率下在空气中通过热重分析法测量的温度为300℃至500℃。