公开(公告)号：US20240240012A1

公开(公告)日：2024-07-18

申请号：US18618598

申请日：2024-03-27

申请人： Safran Cabin Inc.

发明人： Bhaskar Biswas ,  Jack V. Lally

IPC分类号： C08L63/04 ,  C08G59/14 ,  C08G59/22 ,  C08G59/24 ,  C08G59/38 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/62 ,  C08K3/016 ,  C08K5/00

CPC分类号： C08L63/04 ,  C08G59/1488 ,  C08G59/223 ,  C08G59/245 ,  C08G59/38 ,  C08G59/4064 ,  C08G59/42 ,  C08G59/50 ,  C08G59/621 ,  C08K3/016 ,  C08K5/0066 ,  C08L2201/02 ,  C08L2205/025

摘要： A composition formed of an epoxy resin incorporating a fire retardant.

公开(公告)号：US11965059B2

公开(公告)日：2024-04-23

申请号：US17601674

申请日：2020-04-09

申请人： NISSAN CHEMICAL CORPORATION

发明人： Shigetaka Otagiri ,  Tokio Nishita ,  Takafumi Endo ,  Yuki Endo ,  Takahiro Kishioka

IPC分类号： C08G59/14 ,  C08G59/16 ,  C08G59/26 ,  C08G59/62 ,  C08G59/68 ,  C09D163/00 ,  C09D163/10 ,  G03F7/11 ,  H01L21/02 ,  H01L21/027 ,  H01L21/033 ,  H01L21/67

CPC分类号： C08G59/1483 ,  C08G59/1455 ,  C08G59/26 ,  C08G59/621 ,  C08G59/68 ,  H01L21/027 ,  H01L21/67075

摘要： A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

公开(公告)号：US11932777B2

公开(公告)日：2024-03-19

申请号：US18078281

申请日：2022-12-09

申请人： Winamac Coil Spring, Inc.

发明人： Paul Thottathil ,  John M. Ryan ,  Purushothaman Kesavan ,  Satyabrata Mukherjee

IPC分类号： C09D5/08 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00 ,  C09D4/06 ,  C09D163/00 ,  C09D167/08

CPC分类号： C09D5/08 ,  C08G59/4021 ,  C08G59/621 ,  C08L63/00 ,  C09D4/06 ,  C09D163/00 ,  C09D167/08 ,  C08L63/00 ,  C08L27/12 ,  C08L33/12 ,  C08L67/06 ,  C09D163/00 ,  C08L27/12 ,  C08L33/12 ,  C08L67/06

摘要： Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

公开(公告)号：US11926695B2

公开(公告)日：2024-03-12

申请号：US16898761

申请日：2020-06-11

申请人： Samsung Electronics Co., Ltd.

发明人： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC分类号： C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

CPC分类号： C08G59/245 ,  C08G59/26 ,  C08G59/621 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/641

摘要： A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.

E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1

In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

公开(公告)号：US20240067772A1

公开(公告)日：2024-02-29

申请号：US18383072

申请日：2023-10-24

申请人： Samsung Electronics Co., Ltd.

发明人： Changho NOH ,  Insu LEE ,  Songwon HYUN ,  Yoonseok KO ,  Mijeong KIM ,  Keechang LEE ,  Sangsoo JEE

IPC分类号： C08G59/24 ,  C08K3/013 ,  C08G59/62 ,  C08L63/00

CPC分类号： C08G59/245 ,  C08K3/013 ,  C08G59/621 ,  C08L63/00 ,  C08G2170/00 ,  C08G2190/00 ,  C08K2201/001 ,  C08L2203/206

摘要： An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:


E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2  Formula 1



E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4  Formula 2

In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

公开(公告)号：US11897998B2

公开(公告)日：2024-02-13

申请号：US16759677

申请日：2018-10-26

申请人： ENEOS Corporation

发明人： Yoshinori Nishitani ,  Masaki Minami ,  Tatsuki Sato

IPC分类号： C08G59/62

CPC分类号： C08G59/621

摘要： The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

公开(公告)号：US11891475B2

公开(公告)日：2024-02-06

申请号：US17845720

申请日：2022-06-21

申请人： ISOLA USA CORP.

发明人： Edward Kelley ,  Teck Kai Wong ,  Rebekah F. Theisen ,  Christopher G. Clark, Jr.

IPC分类号： B32B3/10 ,  C08G59/42 ,  C08L35/06 ,  C08G59/62 ,  C08L63/00 ,  C08J5/24

CPC分类号： C08G59/4215 ,  C08G59/621 ,  C08J5/244 ,  C08J5/249 ,  C08L35/06 ,  C08L63/00 ,  C08J2325/14 ,  C08J2335/06 ,  C08J2463/02 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2312/00 ,  C08L63/00 ,  C08K3/34 ,  C08K3/36 ,  C08L35/06

摘要： Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

公开(公告)号：US11827741B2

公开(公告)日：2023-11-28

申请号：US17546294

申请日：2021-12-09

申请人： Samsung Electronics Co., Ltd.

发明人： Changho Noh ,  Insu Lee ,  Songwon Hyun ,  Yoonseok Ko ,  Mijeong Kim ,  Keechang Lee ,  Sangsoo Jee

IPC分类号： C08G59/24 ,  C08K3/013 ,  C08G59/62 ,  C08L63/00

CPC分类号： C08G59/245 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08G2170/00 ,  C08G2190/00 ,  C08K2201/001 ,  C08L2203/206

摘要： An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:

E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2  Formula 1

E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4  Formula 2

In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

公开(公告)号：US20230250323A1

公开(公告)日：2023-08-10

申请号：US18010548

申请日：2021-06-17

申请人： NIPPON STEEL CORPORATION

发明人： Kazutoshi TAKEDA ,  Shinsuke TAKATANI ,  Minako FUKUCHI ,  Ichiro TANAKA

IPC分类号： C09J163/00 ,  C08G59/24 ,  C08G59/62 ,  C08G59/50 ,  C08G59/56 ,  C09J11/06 ,  C09J5/00 ,  H01F1/18 ,  B32B15/01 ,  B32B7/12

CPC分类号： C09J163/00 ,  C08G59/245 ,  C08G59/621 ,  C08G59/5033 ,  C08G59/5006 ,  C08G59/56 ,  C09J11/06 ,  C09J5/00 ,  H01F1/18 ,  B32B15/011 ,  B32B7/12 ,  C09J2400/166 ,  C09J2463/00 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2307/748 ,  B32B2307/208

摘要： This coating composition for an electrical steel sheet contains an epoxy resin, a phenolic curing agent (A) and one or more amine-based curing agents (B) selected from the group consisting of an aromatic amine and dicyandiamide, the amount of the phenolic curing agent (A) is 1 to 40 parts by mass with respect to 100 parts by mass of the epoxy resin, and the amount of the amine-based curing agents (B) is 0.5 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

公开(公告)号：US20230242705A1

公开(公告)日：2023-08-03

申请号：US18296080

申请日：2023-04-05

申请人： AJINOMOTO CO., INC.

发明人： Ichiro OGURA

IPC分类号： C08G59/42 ,  C08G59/62 ,  C08G59/18 ,  C08J5/18 ,  C09D163/00 ,  C07C69/78 ,  H01L23/29 ,  H05K1/03 ,  H01L23/00

CPC分类号： C08G59/4223 ,  C08G59/621 ,  C08G59/182 ,  C08J5/18 ,  C09D163/00 ,  C07C69/78 ,  H01L23/295 ,  H01L23/293 ,  H05K1/0373 ,  H05K1/034 ,  H01L24/29 ,  C08J2363/00 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29388 ,  H01L2924/05442 ,  H01L2224/29387 ,  H01L2224/2919 ,  H05K2201/0209 ,  H01L2924/062 ,  H01L2924/095

摘要： Compounds including two or more aromatic rings to which a fluorine-substituted arylcarbonyloxy group is directly bonded are useful as epoxy resin curing agents.