公开(公告)号：US20080054456A1

公开(公告)日：2008-03-06

申请号：US11828409

申请日：2007-07-26

申请人： Un-byoung KANG ,  Yong-hwan KWON ,  Chung-sun LEE ,  Woon-seong KWON ,  Hyung-sun JANG

发明人： Un-byoung KANG ,  Yong-hwan KWON ,  Chung-sun LEE ,  Woon-seong KWON ,  Hyung-sun JANG

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/73203 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor package includes a semiconductor chip operatively attached to a conductive lead of a film circuit substrate by an indium-containing solder material and a silver-containing bump electrode, where the solder material is interposed between the conductive lead and the bump electrode.

摘要翻译： 半导体封装包括通过含铟焊料材料和含银凸点电极可操作地附接到膜电路基板的导电引线的半导体芯片，其中焊料材料插入在导电引线和凸块电极之间。