公开(公告)号：US20080057680A1

公开(公告)日：2008-03-06

申请号：US11892914

申请日：2007-08-28

Applicant: Yosuke Watanabe

Inventor： Yosuke Watanabe

IPC: H01L21/78

CPC classification number: H01L21/78 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50

Abstract: A method of carrying out laser processing on a wafer having a plurality of parallel streets on the front surface along the streets, comprising the steps of: carrying out a first laser processing step of carrying out laser processing along streets formed in one half area of the wafer by carrying out a laser beam application step for applying a laser beam along the streets by positioning the outermost street on one side in the indexing-feed direction of the wafer right below a condenser and an indexing-feed step for positioning a street adjacent to the street which has undergone the laser beam application step on the wafer right below the condenser sequentially; and carrying out a second laser processing step of carrying out laser processing along streets formed in the other half area of the wafer by carrying out a laser beam application step for applying a laser beam along the streets by positioning the outermost street on the other side in the indexing-feed direction of the wafer which has undergone the first laser processing step right below the condenser and an indexing-feed step for positioning a street adjacent to the street which has undergone the laser beam application step on the wafer right below the condenser sequentially.

Abstract translation: 一种在沿着街道的前表面上具有多个平行街道的晶片上执行激光加工的方法，包括以下步骤：执行第一激光加工步骤，沿着形成在 晶片，其通过执行激光束施加步骤，用于沿着街道施加激光束，将最外面的街道定位在晶片正下方的冷凝器的分度馈送方向的一侧和用于定位邻近的街道的分度馈送步骤 在冷凝器的正下方顺序地在晶片上经过激光束施加步骤的街道; 并执行第二激光处理步骤，通过执行激光束施加步骤，沿着形成在晶片的另一半区域中的街道进行激光处理，用于通过将最外面的街道定位在另一侧上来沿着街道施加激光束 在冷凝器正下方经历了第一激光加工步骤的晶片的分度馈送方向和用于将经过激光束施加步骤的街道相邻的街道定位在冷凝器正下方的晶片上的分度馈送步骤 。

公开(公告)号：US07336782B2

公开(公告)日：2008-02-26

申请号：US10730328

申请日：2003-12-08

Applicant: Yosuke Watanabe ,  Masatomo Mizuta ,  Mitsuru Sendoda ,  Koji Matsunaga ,  Takeshi Komatsu

Inventor： Yosuke Watanabe ,  Masatomo Mizuta ,  Mitsuru Sendoda ,  Koji Matsunaga ,  Takeshi Komatsu

IPC: H04M9/00 ,  H04M1/00

CPC classification number: H04M1/0212 ,  H01R35/025 ,  H05K1/0393

Abstract: A wiring device is used in a folding portable device including a hinge unit permitting an upper unit to fold/unfold and/or to rotate with regard to a lower unit. The wiring device comprises a rotative direction wound portion having a first central axis corresponding to a rotating axis of the hinge. A folding/unfolding direction wound portion has a second central axis corresponding to a folding/unfolding axis of the hinge. A FPC fixing member fixes a FPC holding member holding a predetermined part of a FPC to the hinge. The rotative direction wound portion is wound with a first part of a flexible printed cable that is continuous with one end of the predetermined part. The folding/unfolding direction wound portion is wound with a second part of the flexible printed cable that is continuous with the other end of the predetermined part.

Abstract translation: 一种布线装置用于折叠式便携式装置，其包括允许上部单元相对于下部单元折叠/展开和/或旋转的铰链单元。 布线装置包括具有对应于铰链的旋转轴线的第一中心轴线的旋转方向卷绕部分。 折叠/展开方向缠绕部分具有对应于铰链的折叠/展开轴线的第二中心轴线。 FPC固定部件将保持FPC的预定部分的FPC保持部件固定在铰链上。 旋转方向卷绕部分与柔性印刷电缆的与预定部分的一端连续的第一部分卷绕。 折叠/展开方向卷绕部分与柔性印刷电缆的与预定部分的另一端连续的第二部分卷绕。

公开(公告)号：US07320153B2

公开(公告)日：2008-01-22

申请号：US11452934

申请日：2006-06-15

Applicant: Yosuke Watanabe ,  Masatomo Mizuta ,  Mitsuru Sendouda

Inventor： Yosuke Watanabe ,  Masatomo Mizuta ,  Mitsuru Sendouda

IPC: E05D3/10 ,  E05D17/64 ,  E05D11/06 ,  E05D5/10

CPC classification number: H04M1/0212 ,  E05D3/10 ,  E05D11/1078 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1681 ,  Y10T16/5403 ,  Y10T16/547 ,  Y10T16/5472 ,  Y10T16/551 ,  Y10T16/557

Abstract: A fold-type cellular phone has a top unit, a bottom unit and a hinge coupling together the top unit and the bottom unit while allowing the top unit to turn and swivel with respect to the bottom unit. The top unit is first unfolded from a first folded position to an attitude angle of 160 to 170 degrees, and swiveled by 180 degrees to be folded onto the bottom unit in a second folded position at an attitude angle of 180 degrees. The swivel movement of the top unit causes a cam assembly to turn the top unit from the attitude angle of 160-170 degrees to an attitude angle of 180 degrees in the second folded position, thereby allowing the top unit to assume a suitable attitude with respect to the bottom unit.

Abstract translation: 折叠型蜂窝电话具有顶部单元，底部单元和联接在一起的顶部单元和底部单元的铰链，同时允许顶部单元相对于底部单元旋转和旋转。 顶部单元首先从第一折叠位置展开至160至170度的姿态角度，并以180度的姿态角度以第二折叠位置旋转180度以折叠到底部单元上。 顶部单元的旋转运动导致凸轮组件将顶部单元从160-170度的姿态角度转到第二折叠位置的180度的姿态角度，从而允许顶部单元相对于 到底部单位。

公开(公告)号：US06233469B1

公开(公告)日：2001-05-15

申请号：US09061748

申请日：1998-04-16

Applicant: Yosuke Watanabe

Inventor： Yosuke Watanabe

IPC: H04B138

CPC classification number: H04M1/0214 ,  H04M1/0235 ,  H04M1/0247 ,  H04M1/0266 ,  H04M1/72519 ,  H04M1/72533 ,  H04M2250/22

Abstract: In a portable wireless information terminal apparatus, a terminal main body unit having a receiver unit and a transmitter unit. A data display unit is movably provided on the terminal main body unit.

Abstract translation: 在便携式无线信息终端装置中，具有接收单元和发送单元的终端主体单元。 数据显示单元可移动地设置在终端主体单元上。

公开(公告)号：US08753984B2

公开(公告)日：2014-06-17

申请号：US13332691

申请日：2011-12-21

Applicant: Hiroki Murakami ,  Yosuke Watanabe ,  Kazuhide Hasebe

Inventor： Hiroki Murakami ,  Yosuke Watanabe ,  Kazuhide Hasebe

IPC: H01L21/20

CPC classification number: C23C16/345 ,  C23C16/45525

Abstract: A method of forming a silicon nitride film on the surface of an object to be processed, the method including forming a seed layer functioning as a seed of the silicon nitride film on the surface of the object to be processed by using at least an aminosilane-based gas, prior to forming the silicon nitride film on the surface of the object to be processed.

Abstract translation: 一种在待处理物体的表面上形成氮化硅膜的方法，该方法包括通过使用至少一种氨基硅烷化合物形成在待加工物体的表面上起氮化硅膜的晶种的种子层的作用， 在将待加工物体的表面上形成氮化硅膜之前。

公开(公告)号：US20120309230A1

公开(公告)日：2012-12-06

申请号：US13520684

申请日：2010-12-28

Applicant: Yosuke Watanabe ,  Yuichi Sasaki ,  Chiharu Miyazaki ,  Naoto Oka ,  Koichiro Misu

Inventor： Yosuke Watanabe ,  Yuichi Sasaki ,  Chiharu Miyazaki ,  Naoto Oka ,  Koichiro Misu

IPC: H01R13/66

CPC classification number: H01R31/06 ,  H01R13/501 ,  H01R13/502 ,  H01R13/6625 ,  H01R13/6633 ,  H01R13/7197 ,  H01R24/44

Abstract: A cable coupler including an external cylinder mechanism having an inner conductor for electrically connecting the inner conductor itself to the outer conductors of the shielded cables, an outer conductor having a larger diameter than the inner conductor, a gap portion disposed between the inner conductor and the outer conductor, and capacitors arranged in the gap portion, for electrically connecting between the outer conductor and the inner conductor, an inner potion of the external cylinder mechanism being able to be opened and closed along a longitudinal direction, an internal coupling mechanism placed inside the inner conductor and having connecting pins for holding the core wires of the shielded cables, for electrically connecting between the core wires of the shielded cables, and a base for holding the external cylinder mechanism and for electrically connecting the external cylinder mechanism to an external conductor.

Abstract translation: 一种电缆耦合器，包括具有内部导体的外部气缸机构，所述内部导体用于将内部导体本身与屏蔽电缆的外部导体电连接，具有比内部导体更大的直径的外部导体，设置在内部导体和 外导体和电容器，其设置在间隙部分中，用于电连接外导体和内导体，外筒体机构的内部部分能够沿纵向方向打开和关闭，内部联接机构设置在内部导体 内部导体，并且具有用于保持屏蔽电缆的芯线的连接销，用于电连接屏蔽电缆的芯线和用于保持外部气缸机构的基座和用于将外部气缸机构电连接到外部导体。

公开(公告)号：US07951977B2

公开(公告)日：2011-05-31

申请号：US11920774

申请日：2006-06-05

Applicant: Tetsuya Ikemoto ,  Yosuke Watanabe

Inventor： Tetsuya Ikemoto ,  Yosuke Watanabe

IPC: C07C47/00 ,  C07C31/18 ,  C07D493/04

CPC classification number: C07B53/00 ,  C07C45/30 ,  C07C45/72 ,  C07C47/198 ,  C07D493/04 ,  Y02P20/55 ,  C07C47/277

Abstract: The present invention provides; a process for producing a compound (IV) comprising a step of reacting a compound (I) with a compound (II) in the presence of an optionally substituted cyclic secondary amine to obtain a compound (III) and a step of sequentially or simultaneously eliminating R1 and R2 from the compound (III), and then cyclizing the R1- and R2-eliminated compound to obtain the compound represented by the formula (IV); a process for producing a high purity compound (IV); an intermediate thereof; and a process for producing an intermediate.

Abstract translation: 本发明提供： 一种制备化合物（Ⅳ）的方法，包括在任意取代的环状仲胺存在下，使化合物（Ⅰ）与化合物（Ⅱ）反应得到化合物（Ⅲ）和顺序或同时除去的步骤 R1和R2，然后使R 1和R 2消去的化合物环化，得到由式（IV）表示的化合物; 一种生产高纯度化合物（Ⅳ）的方法; 其中间体; 和中间体的制造方法。

公开(公告)号：US20100331546A1

公开(公告)日：2010-12-30

申请号：US12866506

申请日：2009-02-17

Applicant: Yosuke Watanabe ,  Junichi Yasuoka ,  Tetsuya Ikemoto

Inventor： Yosuke Watanabe ,  Junichi Yasuoka ,  Tetsuya Ikemoto

IPC: C07D211/58

CPC classification number: C07D211/56 ,  C07B57/00 ,  C07C59/255

Abstract: Disclosed is a method for optical resolution of an alkylpiperidin-3-yl carbamate, the method including bringing an RS mixture of an alkylpiperidin-3-yl carbamate into contact with an optically active tartaric acid in the presence of a solvent.

Abstract translation: 公开了一种用于光学拆分烷基哌啶-3-基氨基甲酸酯的方法，该方法包括使烷基哌啶-3-基氨基甲酸酯的RS混合物与光学活性酒石酸在溶剂存在下接触。

公开(公告)号：US07605286B2

公开(公告)日：2009-10-20

申请号：US10567150

申请日：2004-06-23

Applicant: Tetsuya Ikemoto ,  Yosuke Watanabe

Inventor： Tetsuya Ikemoto ,  Yosuke Watanabe

IPC: C07C69/66 ,  C07C43/20

CPC classification number: C07B41/04 ,  C07D307/32 ,  Y02P20/55

Abstract: The present invention relates to a method of protecting a hydroxyl group, which includes reacting a hydroxyl group-containing compound with a compound represented by the formula (I): wherein R is a phenyl group optionally having substituent(s), an alkyl group optionally having substituent(s) or a benzyl group optionally having substituent(s), and X is a halogen atom, in the presence of an acid catalyst to substitute the hydrogen atom of the hydroxyl group of the hydroxyl group-containing compound with a protecting group represented by the formula (II): wherein R is as defined above. The present invention provides a method capable of introducing an acetal type protecting group into a hydroxyl group under mild conditions, and a protecting reagent therefor and a method of producing the protecting reagent.

Abstract translation: 本发明涉及保护羟基的方法，其包括使含羟基的化合物与式（I）表示的化合物反应：其中R是任选具有取代基的苯基，任选地具有取代基的烷基 具有取代基或任选具有取代基的苄基，X是卤素原子，在酸催化剂存在下，用保护基取代含羟基化合物的羟基的氢原子 由式（II）表示：其中R如上所定义。 本发明提供能够在温和条件下将缩醛型保护基引入羟基的方法及其保护试剂，以及制备保护试剂的方法。

公开(公告)号：US07544590B2

公开(公告)日：2009-06-09

申请号：US11892914

申请日：2007-08-28

Applicant: Yosuke Watanabe

Inventor： Yosuke Watanabe

IPC: H01L21/268

CPC classification number: H01L21/78 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50

Abstract: A method of carrying out laser processing on a wafer having a plurality of parallel streets on the front surface along the streets, comprising the steps of: carrying out a first laser processing step of carrying out laser processing along streets formed in one half area of the wafer by carrying out a laser beam application step for applying a laser beam along the streets by positioning the outermost street on one side in the indexing-feed direction of the wafer right below a condenser and an indexing-feed step for positioning a street adjacent to the street which has undergone the laser beam application step on the wafer right below the condenser sequentially; and carrying out a second laser processing step of carrying out laser processing along streets formed in the other half area of the wafer by carrying out a laser beam application step for applying a laser beam along the streets by positioning the outermost street on the other side in the indexing-feed direction of the wafer which has undergone the first laser processing step right below the condenser and an indexing-feed step for positioning a street adjacent to the street which has undergone the laser beam application step on the wafer right below the condenser sequentially.

Abstract translation: 一种在沿着街道的前表面上具有多个平行街道的晶片上执行激光加工的方法，包括以下步骤：执行第一激光加工步骤，沿着形成在 晶片，其通过执行激光束施加步骤，用于沿着街道施加激光束，将最外面的街道定位在晶片正下方的冷凝器的分度馈送方向的一侧和用于定位邻近的街道的分度馈送步骤 在冷凝器的正下方顺序地在晶片上经过激光束施加步骤的街道; 并执行第二激光处理步骤，通过执行激光束施加步骤，沿着形成在晶片的另一半区域中的街道进行激光处理，用于通过将最外面的街道定位在另一侧上来沿着街道施加激光束 在冷凝器正下方经历了第一激光加工步骤的晶片的分度馈送方向和用于将经过激光束施加步骤的街道相邻的街道定位在冷凝器正下方的晶片上的分度馈送步骤 。