公开(公告)号：US20120120605A1

公开(公告)日：2012-05-17

申请号：US12944680

申请日：2010-11-11

申请人： Amilcar Arvelo ,  Jason R. Eagle ,  Eric A. Eckberg ,  Gary F. Goth ,  Katie L. Pizzolato ,  Scott A. Shurson

发明人： Amilcar Arvelo ,  Jason R. Eagle ,  Eric A. Eckberg ,  Gary F. Goth ,  Katie L. Pizzolato ,  Scott A. Shurson

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  G06F1/20

摘要： A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.

摘要翻译： 从串行存储器模块和/或电路板去除热量的系统可以包括一个冷轨，用于接合直列式存储器模块可连接到电路板的位置的直列式存储器模块的每一端， 用于从串行内存模块中移除热量的冷轨。 该系统还可以包括连接到冷轨的冷板，电路板在冷板和冷轨之间，冷板用于从电路板去除热量。

公开(公告)号：US07908906B2

公开(公告)日：2011-03-22

申请号：US11468089

申请日：2006-08-29

申请人： Govindarajan Natarajan ,  Emmanuel Delamarche ,  Eric A Eckberg ,  James N Humenik ,  Kathleen A McGroddy-Goetz ,  Scott Partington ,  Christopher F Perrera ,  Marco G Trivella ,  Timothy M Wiwel

发明人： Govindarajan Natarajan ,  Emmanuel Delamarche ,  Eric A Eckberg ,  James N Humenik ,  Kathleen A McGroddy-Goetz ,  Scott Partington ,  Christopher F Perrera ,  Marco G Trivella ,  Timothy M Wiwel

IPC分类号： G01N13/04

CPC分类号： G01N13/04 ,  A61B2010/0067

摘要： An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.

摘要翻译： 用于测定流体渗透压的装置，系统和方法。 该系统包括具有：具有基本平坦的顶表面的芯片的装置; 第一电路部分和第二电路部分，每个具有设置在顶表面上的多个冗余导电线; 以及设置在第一电路部分和第二电路部分之间的间隙，其中当流体样品桥接间隙并连接第一电路部分和第二电路部分时产生电路。

公开(公告)号：US20080266798A1

公开(公告)日：2008-10-30

申请号：US11740026

申请日：2007-04-25

申请人： Eric A. Eckberg ,  James D. Gerken ,  Laurie Gerken

发明人： Eric A. Eckberg ,  James D. Gerken ,  Laurie Gerken

IPC分类号： H05K7/20

CPC分类号： H05K7/20272

摘要： A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion.

摘要翻译： 液体冷却的电子系统和方法包括通过冷却剂通路可旋转地连接到第二部件的第一部件。 冷却剂通道包括设置和构造成将冷却剂从第一部件通过铰链组件输送到第二部件的至少一个铰链组件。 铰链组件包括与第一部件可操作地连通的第一铰链部分，与第二部件可操作地连通的第二铰链部分; 以及铰链销，其设置和构造成输送流体，并将第一铰链部分连接到第二铰链部分。

公开(公告)号：US20080151504A1

公开(公告)日：2008-06-26

申请号：US12044015

申请日：2008-03-07

申请人： Eric A. Eckberg ,  Michael S. Good ,  Mark D. Pfeifer

发明人： Eric A. Eckberg ,  Michael S. Good ,  Mark D. Pfeifer

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

摘要翻译： 本文公开了一种模块冷却系统，包括：与电路板可操作地连通的模块，邻接电路板的加强件，邻近模块的散热器，朝向模块偏置散热器的第一偏置构件，多个不影响 紧固件位置地固定散热器;以及第二偏置构件，将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法，包括：将模块电连接到电路板，将加强件邻接到电路板，将散热器邻接到模块，用偏置构件偏置散热器朝向 模块，用不影响紧固件固定散热器，并且用电路板和模块朝向散热器的第二偏置构件偏置。

公开(公告)号：US07375963B2

公开(公告)日：2008-05-20

申请号：US11279266

申请日：2006-04-11

申请人： Eric A. Eckberg ,  Michael S. Good ,  Mark D. Pfeifer

发明人： Eric A. Eckberg ,  Michael S. Good ,  Mark D. Pfeifer

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

摘要翻译： 本文公开了一种模块冷却系统，包括：与电路板可操作地连通的模块，邻接电路板的加强件，邻近模块的散热器，朝向模块偏置散热器的第一偏置构件，多个不影响 紧固件位置地固定散热器;以及第二偏置构件，将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法，包括：将模块电连接到电路板，将加强件邻接到电路板，将散热器邻接到模块，用偏置构件偏置散热器朝向 模块，用不影响紧固件固定散热器，并且用电路板和模块朝向散热器的第二偏置构件偏置。