Abstract:
A system and method for allowing a user to schedule pickup of an ordered item provides a user interface having user interface elements for allowing a user to specify a frequency with which an order is it to be picked up, for informing a user as to availability of the item for pickup, and/or for allowing a user to request that an item be held in reserve for pickup within a given period of time, such as 24 hours. Frequency options provided to the user for selection when scheduling an order for pickup may include a one-time frequency, a daily frequency, a weekly frequency, a monthly frequency, and user specified dates. The information as to availability of the item for pickup is determined considering a time of order and real-time stocking information for the item.
Abstract:
A system and method for measuring a cable resistance in a power over Ethernet (PoE) application. A short circuit module in a powered device is designed to produce a short circuit effect upon receipt of a cable resistance detection voltage. The cable resistance detection voltage can be designed to be greater than a voltage for detection or classification and less than a voltage for powering of the powered device. The measurement of the current at a time when a short circuit effect is produced at the powered device enables a calculation of the actual resistance of the cable on a given PoE port.
Abstract:
A system and method for measuring a cable resistance in a power over Ethernet (PoE) application. A short circuit module in a powered device is designed to produce a short circuit effect upon receipt of a cable resistance detection voltage. The cable resistance detection voltage can be designed to be greater than a voltage for detection or classification and less than a voltage for powering of the powered device. The measurement of the current at a time when a short circuit effect is produced at the powered device enables a calculation of the actual resistance of the cable on a given PoE port.
Abstract:
An SPI switch allows selection of a BIOS memory transparent to a Southbridge chipset component. The SPI switch provides address translation to a selected BIOS memory area under the control of a security module processor. The SPI switch also provides command filtering to prevent commands that represent a security risk such as bulk erase commands. Because the SPI switch allows transparent redirection between BIOS programs, booting in different operating modes may be supported without any changes to the basic computer architecture or major chipset components.
Abstract:
A digital image capture system includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connections between the image sensor and a circuit board. The package structure includes attachment features that enable an optics system to be securely attached to the package structure after the package structure has been soldered to the circuit board In an embodiment, the attachment features align the optics system with the image sensor without having to power up the image sensor. An embodiment of the attachment features includes mechanical attachment features, such as clip arms and/or clip receivers. In an embodiment, the optics system includes attachment features that are complementary to the attachment features of the package structure. The package structure and optics system may additionally include complementary contact surfaces that create a light-tight connection between the optics system and the package structure.
Abstract:
A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element. In an embodiment of the digital image capture system, the powered lens element includes an opaque surface that prevents unwanted light from contacting the image sensor. An advantage of the digital image capture system is that no additional lens mounting structures are required to attach a powered lens element to the image sensor package.