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公开(公告)号：US20230021657A1
公开(公告)日：2023-01-26
申请号：US17860636
申请日：2022-07-08
Inventor： Hironori AKIYAMA
IPC: H03K17/041 , H03K17/28 , H03K17/06 , H03K17/14
Abstract: A change rate control circuit computes a first drive speed, which is a gate drive speed of a gate of a drive-subject element, for controlling a change rate of an element voltage of the drive-subject element at a target change rate during a change period. A timing generating circuit acquires, in advance, a delay time caused when the gate is driven and determines a switching timing, at which the element voltage reaches a switching threshold voltage which is lower than a desired switching voltage by a predetermined value, during turn-off of the drive-subject element and generates a timing signal representing the switching timing. A speed change circuit changes the gate drive speed from the first drive speed to a second drive speed at the switching timing during turn-off of the drive-subject element.
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公开(公告)号：US20220407225A1
公开(公告)日：2022-12-22
申请号：US17833952
申请日：2022-06-07
Inventor： Masato KOHTANI
Abstract: An antenna array for a high frequency device includes a plurality of antenna elements used for a radar device and arranged in a two-dimensional array in a predetermined area. The plurality of antenna elements includes grouped on-elements and single on-elements with specific distance for grating lobe cancellation, each of them is electrically connected to a phase shifter. The on-elements are arranged such that density of the on-elements at a center portion in the two-dimensional array is high and density of the on-elements at four corners in the two-dimensional array is low.
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公开(公告)号：US20220392828A1
公开(公告)日：2022-12-08
申请号：US17824004
申请日：2022-05-25
Inventor： YOSHITAKA KATO , TAKESHI ENDO , KAZUHIRO TSURUTA
IPC: H01L23/433 , H01L23/31 , H01L21/56
Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.
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公开(公告)号：US20220373332A1
公开(公告)日：2022-11-24
申请号：US17730284
申请日：2022-04-27
Inventor： YUUKI INAGAKI , YUSUKE KAWAI , TAKAHIKO YOSHIDA , SHOTA HARADA , KATSUAKI GOTO , KEITARO ITO
IPC: G01C19/5712
Abstract: An inertial sensor includes a lower substrate and an upper substrate. The upper substrate includes a micro oscillator, electrodes and a pad, which are independent of each other. The micro oscillator includes a curved surface portion, a joint portion recessed inward from an apex of the curved surface portion and joined to a support portion of the lower substrate, a rim at an end of the curved surface portion and a conductive film covering the micro oscillator. The curved surface portion is in an aerial state. The rim is made of the same material as the electrodes, located on a virtual flat plane formed by the electrodes, and apart from and surrounded by the electrodes. A portion of the conductive film that covers the joint portion is electrically bonded to a lower metal film covering the support portion.
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公开(公告)号：US20220340011A1
公开(公告)日：2022-10-27
申请号：US17722444
申请日：2022-04-18
Inventor： Hyoungjun NA , Yoshikazu FURUTA , Shigeki OTSUKA , Takasuke ITO , Tomohiro NEZUKA
Abstract: In a communication system, a control unit and driver units are connected in a daisy chain; each unit includes a corresponding insulated communication circuit, respectively. The control unit measures a communication delay time between the control unit and each driver unit from a response time to transmission of a pulse signal performed to each driver unit during a measurement period. Then, based on each communication delay time, the control unit transmits a shift time to each driver unit for equalizing the timing of signals output by the driver units. When each driver unit receives, from the control unit, an instruction instructing each driver unit to output a signal, each driver unit outputs the signal when the shift time has elapsed.
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Patent Agency Ranking
公开(公告)号：US20220317277A1
公开(公告)日：2022-10-06
申请号：US17693772
申请日：2022-03-14
Inventor： Sungwoo CHA
Abstract: A radar device includes a transmitter module configured to generate transmission waves including: generating a first chirp chain at a first chirp rate for a transmission wave to be output including: generating a first transmission signal including at least one modulated signal to be output at a first angle; and generating a second transmission signal to be output at a second angle different from the first angle; and generating a second chirp chain at a second chirp rate for the transmission wave to be output including: generating a third transmission signal including at least one modulated signal to be output at the first angle; and generating a fourth transmission signal including at least one modulated signal to be output at the second angle, where the first chirp rate is different than the second chirp rate.
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公开(公告)号：US20220316880A1
公开(公告)日：2022-10-06
申请号：US17703164
申请日：2022-03-24
Inventor： Shota HARADA , Keitaro ITO , Katsuaki GOTO , Yuuki INAGAKI , Takahiko YOSHIDA , Yusuke KAWAI , Teruhisa AKASHI , Hirofumi FUNABASHI
Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.
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公开(公告)号：US20220301762A1
公开(公告)日：2022-09-22
申请号：US17555594
申请日：2021-12-20
Inventor： Masahiro TSUCHIDA , Akihiro YAMAGUCHI , Ryota KOJIMA
Abstract: An electronic device has a substrate, a signal wiring and a heat radiating wiring. The substrate has one surface and the other surface opposite to the one surface. The signal wiring is formed on an insulating layer of the substrate. The heat radiating wiring is formed on the insulating layer and thermally connected to the signal wiring on a same plane as the signal wiring.
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公开(公告)号：US20220283475A1
公开(公告)日：2022-09-08
申请号：US17687054
申请日：2022-03-04
Inventor： HIKARU SASAKI , KOICHI OYAMA , TARO BEPPU
Abstract: An optical scanner includes a substrate, an optical phased array, a shape sensor, a deviation calculation unit, and a control unit. The optical phased array includes an antenna array having a plurality of antenna elements. The deviation calculation unit calculates an amount of positional deviation of each antenna element based on an amount of deformation of the substrate detected by the shape sensor, and calculates an amount of phase deviation of light emitted from each antenna element. The control unit corrects the phase of light emitted from each antenna element based on the amount of phase deviation calculated by the deviation calculation unit, and controls the phase of the antenna element so that the antenna array emits the light in a target direction.
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50.发明申请公开(公告)号：US20220262634A1
公开(公告)日：2022-08-18
申请号：US17591202
申请日：2022-02-02
Inventor： TETSUYA YAMADA
IPC: H01L21/02 , H01L23/544 , H01L21/265 , H01L21/477
Abstract: A method for manufacturing a semiconductor device, includes: forming an alignment mark in a non-element region of a gallium-based compound semiconductor layer; and, after the forming of the alignment mark, forming an element structure in an element region of the gallium-based compound semiconductor layer. The forming of the alignment mark further includes: ion-implanting a metal into a part of a surface layer portion of the non-element region of the gallium-based compound semiconductor layer; and annealing the gallium-based compound semiconductor layer.
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