公开(公告)号：US20230294190A1

公开(公告)日：2023-09-21

申请号：US18311513

申请日：2023-05-03

Applicant: Yield Engineering Systems, Inc.

Inventor： Tapani Laaksonen ,  M Ziaul Karim ,  Christopher Lane ,  Craig Walter McCoy ,  Ramakanth Alapati

IPC: B23K1/015 ,  B23K1/008 ,  B23K3/08 ,  H01L23/00

CPC classification number: B23K1/015 ,  B23K1/008 ,  B23K3/085 ,  H01L24/742 ,  H01L24/75 ,  B23K2101/42

Abstract: A semiconductor processing apparatus includes a process chamber that defines an enclosure. The enclosure includes a substrate support configured to support a substrate and rotate the substrate about a central axis of the process chamber. The substrate support is also configured to move vertically along the central axis and position the substrate at multiple locations in the enclosure. The apparatus also includes one or more UV lamps configured to irradiate a top surface of the substrate supported on the substrate support.

公开(公告)号：US11335662B2

公开(公告)日：2022-05-17

申请号：US17464863

申请日：2021-09-02

Applicant: Yield Engineering Systems, Inc.

Inventor： M Ziaul Karim ,  Randy Hall ,  Peter Krotov

IPC: B23K1/00 ,  H01L23/00 ,  B23K1/008 ,  B23K1/005 ,  B23K101/40

Abstract: A solder reflow oven may include a reflow chamber and a plurality of vertically spaced apart wafer-support plates positioned in the reflow chamber. A plurality of semiconductor wafers each including a solder are configured to be disposed in the reflow chamber such that each semiconductor wafer is disposed proximate to, and vertically spaced apart from, a wafer-support plate. Each wafer-support plate may include at least one of liquid-flow channels or resistive heating elements. A control system control the flow of a hot liquid through the channels or activate the heating elements to heat a wafer to a temperature above the solder reflow temperature.

公开(公告)号：US11296049B1

公开(公告)日：2022-04-05

申请号：US17463012

申请日：2021-08-31

Applicant: Yield Engineering Systems, Inc.

Inventor： Christopher Lane ,  Eli Vronsky ,  Taylor Nguyen ,  Ronald R Stevens ,  Gabriel Ormonde ,  Jed Hsu

IPC: H01L23/00 ,  B23K1/008 ,  B23K37/04 ,  B23K101/40

Abstract: A solder reflow oven includes a processing chamber that defines an enclosure. The enclosure includes a spindle configured to support a substrate and rotate the substrate about a central axis of the processing chamber. The spindle is also configured to move vertically along the central axis and position the substrate at different locations within the enclosure. The oven further includes a chemical delivery tube configured to direct a chemical vapor into the enclosure, a lamp assembly configured to heat a top surface of the substrate, and a lift assembly configured to move the spindle along the central axis.

公开(公告)号：US20190314738A1

公开(公告)日：2019-10-17

申请号：US16189631

申请日：2018-11-13

Applicant: YIELD ENGINEERING SYSTEMS, INC.

Inventor： WILLIAM MOFFAT ,  CRAIG WALTER MCCOY

IPC: B01D5/00

Abstract: A trap system adapted to trap polyimide or other vapors exiting from a process chamber. The vapors are routed from the process chamber through a heated exit line at low pressure and then cooled, resulting in condensation at a selected location. The condensed vapors accumulate in a liquid trap. A method of condensing polymer vapors in vacuum exit lines of process chambers, where the flow which may have vaporized polymer vapor is cooled to enhance condensation at a chosen location. The liquid trap can be emptied and replaced, resulting in the removal of the condensed liquid. The chamber exit lines are protected from condensation build up.