公开(公告)号：US20070240849A1

公开(公告)日：2007-10-18

申请号：US11309562

申请日：2006-08-23

Applicant: YU-CHEN LIN ,  HONG-BO XU

Inventor： YU-CHEN LIN ,  HONG-BO XU

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A liquid cooling device (1) includes a base (2) enclosing working fluid therein and absorbing heat from a heat-generating electronic component, a heat sink (10) fluidically connecting with the base, and a pump (3) driving the working fluid to circulate between the base and the heat sink. The heat sink has closed top and bottom ends, and includes an outer tube (100) and an inner tube (30) disposed in the outer tube. First and second receiving chambers (34, 14) are respectively formed in the inner tube and between an inner surface of the outer tube and an outer surface of the inner tube for receiving the working fluid therein. The first receiving chamber communicates with the second receiving chamber at an end thereof so that the working fluid flows from the first receiving chamber to the second receiving chamber.

Abstract translation: 液体冷却装置（1）包括在其中包围工作流体并吸收来自发热电子部件的热量的基部（2），与基部流体连接的散热器（10）和驱动工作流体的泵（3） 在基座和散热片之间循环。 散热器具有封闭的顶端和底端，并且包括设置在外管中的外管（100）和内管（30）。 第一和第二接收室（34,14）分别形成在内管中并且在外管的内表面和内管的外表面之间，用于在其中接收工作流体。 第一接收室在其一端与第二接收室连通，使得工作流体从第一接收室流动到第二接收室。

公开(公告)号：US20070146999A1

公开(公告)日：2007-06-28

申请号：US11306369

申请日：2005-12-26

Applicant: Yu-Chen Lin ,  Feng Chen

Inventor： Yu-Chen Lin ,  Feng Chen

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device includes a retention module, a heat sink, a locking plate and a clip rotatably connecting with the retention module. The retention module includes an opening in a center thereof. The heat sink includes a heat conducting body and plurality of fins radially extending from the heat conducting body. The heat conducting body has a bottom portion received in the opening of the retention module. The locking plate engages with the bottom portion of the heat conducting body of the heat sink. The locking plate has a first portion abutting a bottom of the retention module, and a second portion opposite to the first portion. The second portion is pressed by a pressing portion of the clip when the heat dissipation device is at a locked position.

Abstract translation: 散热装置包括保持模块，散热器，锁定板和与保持模块可旋转地连接的夹子。 保持模块在其中心包括开口。 散热器包括导热体和从导热体径向延伸的多个翅片。 导热体具有容纳在保持模块的开口中的底部。 锁定板与散热片的导热体的底部接合。 锁定板具有邻接保持模块的底部的第一部分和与第一部分相对的第二部分。 当散热装置处于锁定位置时，第二部分被夹子的按压部分按压。

公开(公告)号：US5982620A

公开(公告)日：1999-11-09

申请号：US87976

申请日：1998-06-01

Applicant: Yu-Chen Lin

Inventor： Yu-Chen Lin

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4093 ,  H01L2924/0002

Abstract: A CPU casing structure includes a casing body having a rear wall on which a side wall is mounted to define an open front side for receiving a nonpackaged a CPU therein. A heat dissipator having a base positionable over and in physical contact engagement with the CPU to provide heat transfer therebetween is releasably secured to the front opening of the casing body by means of at least one clip so as to substantially cover the front opening and thus house the circuit board and the CPU therein. The casing body has at least one clip anchoring members formed on the top edge thereof. The clip have a central section selectively postionable on the base of the heat dissipator and a fixed, but preferably resilient, end extension extending through holes formed on the casing body, the circuit board and the heat dissipator. The end extension has a bending on the free end thereof and the bending is formed as an acute angle to be received within a sloped cavity having an inclination of substantially the same angle formed on the casing body. The clips also have a movable extension defined by a hinged tab having a slot engageable with the respective anchoring member to secure the clips and thus fix the heat dissipator to the casing body together.

Abstract translation: CPU壳体结构包括具有后壁的壳体，其中安装有侧壁，以限定用于在其中接收非封装的CPU的敞开的前侧。 一种散热器，其具有可与CPU对准并与物理接触接合的基座，以在其间提供热传递，借助于至少一个夹子可释放地固定到壳体主体的前开口，以便基本上覆盖前开口并因此容纳 电路板和其中的CPU。 壳体具有形成在其顶部边缘上的至少一个夹子固定构件。 该夹子具有可选择地位于散热器底部的中心部分，以及延伸穿过形成在壳体主体，电路板和散热器上的孔的固定但优选为弹性的端部延伸部。 端部延伸部在其自由端上具有弯曲并且弯曲形成为锐角，以被容纳在具有形成在壳体上的大致相同角度的倾斜的倾斜腔内。 夹子还具有由铰链翼片限定的可移动的延伸部，其具有可与相应的锚固构件接合的狭槽，以固定夹子，从而将散热器固定在壳体上。