Manufacturing method of array substrate, array substrate and display apparatus

    公开(公告)号:US10551695B2

    公开(公告)日:2020-02-04

    申请号:US15866020

    申请日:2018-01-09

    发明人: Kui Gong Xianxue Duan

    摘要: The embodiments of the present disclosure provide a method of manufacturing an array substrate, an array substrate and a display apparatus. A method of manufacturing an array substrate, comprising: providing a substrate; forming, on the substrate, a source electrode, a drain electrode and a passivation layer, wherein a via reaching the source electrode or the drain electrode is formed in the passivation layer by a patterning process; forming a carbon film layer on the passivation layer; forming a photoresist layer on the carbon film layer; patterning the photoresist layer to form a first region and a second region, wherein the first region exposes a portion of the carbon film layer; using the photoresist layer as a mask, modifying the portion of the carbon film layer exposed from the first region to change the electrical conductivity of the portion of the carbon film layer; and removing the photoresist layer.

    Display panel, production method of the same, and display apparatus

    公开(公告)号:US10325935B2

    公开(公告)日:2019-06-18

    申请号:US16034429

    申请日:2018-07-13

    发明人: Dezhi Xu Kui Gong

    IPC分类号: H01L27/12 H01L33/42 H01L33/00

    摘要: This disclosure discloses a display panel, a production method thereof, and a display apparatus. This method comprises: forming a pattern of a first metal layer on a base substrate and a pattern of a metal oxide conductive layer being electrically connected to the first metal layer by at least one through hole at a side of the first metal layer away from the base substrate; forming a reductive metal compound layer on a surface of the first metal layer at a side away from the base substrate before forming the pattern of the metal oxide conductive layer; treating the reductive metal compound layer and the metal oxide conductive layer after forming the pattern of the metal oxide conductive layer so that the reductive metal compound layer is oxidized into a second metal layer and metal particles are produced at the surface of the metal oxide conductive layer.