Memory cell for EEPROM devices, and corresponding fabricating process
    41.
    发明授权
    Memory cell for EEPROM devices, and corresponding fabricating process 失效
    EEPROM器件的存储单元及相应的制造工艺

    公开(公告)号:US6080626A

    公开(公告)日:2000-06-27

    申请号:US996923

    申请日:1997-12-23

    IPC分类号: H01L21/8247

    CPC分类号: H01L27/11521 H01L27/11524

    摘要: A memory cell of the EEPROM type formed on a semiconductor material substrate having a first conductivity type includes a drain region having a second conductivity type and extending at one side of a gate oxide region which includes a thin tunnel oxide region. The memory cell also includes a region of electric continuity having the second conductivity type, being formed laterally and beneath the thin tunnel oxide region, and partly overlapping the drain region. The region of electric continuity is produced by implantation at a predetermined angle of inclination.

    摘要翻译: 形成在具有第一导电类型的半导体材料基板上的EEPROM型存储单元包括具有第二导电类型的漏极区域,并且在包括薄隧道氧化物区域的栅极氧化物区域的一侧延伸。 存储单元还包括具有第二导电类型的电连续性区域,横向形成在薄隧道氧化物区域下方,并且部分地与漏极区域重叠。 通过以预定的倾斜角度的注入产生电连续性的区域。